1N5819RLG ON Semiconductor, 1N5819RLG Datasheet - Page 4

DIODE SCHOTTKY 40V 1A DO41

1N5819RLG

Manufacturer Part Number
1N5819RLG
Description
DIODE SCHOTTKY 40V 1A DO41
Manufacturer
ON Semiconductor
Datasheet

Specifications of 1N5819RLG

Voltage - Forward (vf) (max) @ If
600mV @ 1A
Voltage - Dc Reverse (vr) (max)
40V
Current - Average Rectified (io)
1A
Current - Reverse Leakage @ Vr
1mA @ 40V
Diode Type
Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type
Through Hole
Package / Case
DO-204AL, DO-41, Axial
Rectifier Type
Schottky Diode
Configuration
Single
Peak Rep Rev Volt
40V
Avg. Forward Curr (max)
1
Rev Curr
1000uA
Peak Non-repetitive Surge Current (max)
25A
Forward Voltage
0.9V
Operating Temp Range
-65C to 125C
Package Type
DO-41
Operating Temperature Classification
Military
Mounting
Through Hole
Pin Count
2
Product
Schottky Diodes
Peak Reverse Voltage
40 V
Forward Continuous Current
1 A @ Ta=55C
Max Surge Current
25 A
Forward Voltage Drop
0.9 V @ 3 A
Maximum Reverse Leakage Current
1000 uA
Operating Temperature Range
- 65 C to + 125 C
Mounting Style
Through Hole
Repetitive Reverse Voltage Vrrm Max
40V
Forward Current If(av)
1A
Forward Voltage Vf Max
600mV
Forward Surge Current Ifsm Max
25A
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Capacitance @ Vr, F
-
Lead Free Status / Rohs Status
Compliant
Other names
1N5819RLGOSTR

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(R
line values for preliminary engineering, or in case the tie
point temperature cannot be measured.
Mounting
90
80
70
60
50
40
30
20
10
Method
0.07
0.05
0.03
0.02
0.01
Data shown for thermal resistance, junction−to−ambient
qJA
1.0
0.7
0.5
0.3
0.2
0.1
2
3
1
1
0.1
) for the mountings shown is to be used as typical guide-
Figure 4. Steady−State Thermal Resistance
TYPICAL VALUES FOR R
1/8
NOTE 4. — MOUNTING DATA
BOTH LEADS TO HEATSINK,
0.2
1/8
52
67
EQUAL LENGTH
1/4
L, LEAD LENGTH (INCHES)
MAXIMUM
0.5
Lead Length, L (in)
3/8
1/4
65
80
1.0
50
1/2
1/2
72
87
qJA
2.0
5/8
TYPICAL
IN STILL AIR
100
3/4
85
3/4
5.0
1N5817, 1N5818, 1N5819
Figure 6. Thermal Response
7/8
10
http://onsemi.com
R
°C/W
°C/W
°C/W
qJA
t, TIME (ms)
1.0
20
4
0.07
0.05
5.0
3.0
2.0
1.0
0.7
0.5
0.3
0.2
0.1
L
VECTOR PIN MOUNTING
50
0.2
Mounting Method 1
Sine Wave
I
I
Capacitive
(FM)
(AV)
P.C. Board with
1−1/2″ x 1−1/2″
copper surface.
Loads
L
Mounting Method 2
= π (Resistive Load)
DT
DT
r(t) = normalized value of transient thermal resistance at time, t, from Figure 6,
i.e.:
r(t) =
100
t
JL
JL
Z
p
Figure 5. Forward Power Dissipation
qJL(t)
{
= P
= the increase in junction temperature above the lead temperature
r(t
1
pk
I
+ t
0.4
L
F(AV)
10
20
• R
5
p
= Z
) = normalized value of transient thermal resistance at time, t
200
qJL
t
, AVERAGE FORWARD CURRENT (AMP)
1
qJL
P
[D + (1 − D) • r(t
pk
• r(t)
L
0.6
1N5817−19
500
0.8
P
pk
1
TIME
+ t
p
1.0
L = 3/8″
) + r(t
1.0k
p
BOARD GROUND
DUTY CYCLE, D = t
PEAK POWER, P
an
equivalent square power pulse.
) − r(t
Mounting Method 3
T
1−1/2″ x 1−1/2″
copper surface.
PLANE
P.C. Board with
1
SQUARE WAVE
J
)] where
≈ 125°C
2.0k
2.0
pk
, is peak of
p
dc
/t
1
5.0k
1
+ t
p
.
10k
4.0

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