SS26T3G ON Semiconductor, SS26T3G Datasheet
SS26T3G
Specifications of SS26T3G
SS26T3GOS
SS26T3GOSTR
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SS26T3G Summary of contents
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... Microdot may be in either location) ORDERING INFORMATION Device Package Shipping SS26T3 SMB 2500 / Tape & Reel SS26T3G SMB 2500 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ...
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THERMAL CHARACTERISTICS Characteristic Thermal Resistance − Junction−to−Lead (Note 1) Thermal Resistance − Junction−to−Ambient (Note 2) 1. Mounted with minimum recommended pad size, PC Board FR4 inch square pad size (1 x 0.5 inch for each lead) on FR4 ...
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SQUARE WAVE 1 100 T , LEAD TEMPERATURE (°C) L Figure 5. Current Derating − Junction to Lead 1.0E+00 50% 20% 1.0E−01 10% 5.0% 2.0% 1.0E−02 1.0% 1.0E−03 ...
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... Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...