BAT54L,315 NXP Semiconductors, BAT54L,315 Datasheet - Page 3

• Manufacturer Part Number: BAT54L,315
• Description: DIODE SCHOTTKY 30V 200MA SOD882
• Manufacturer: NXP Semiconductors

Specifications of BAT54L,315

• Package / Case: SOD-882
• Mounting Type: Surface Mount
• Speed: Small Signal =< 200mA (Io), Any Speed
• Current - Reverse Leakage @ Vr: 2µA @ 25V
• Voltage - Forward (vf) (max) @ If: 800mV @ 100mA
• Voltage - Dc Reverse (vr) (max): 30V
• Capacitance @ Vr, F: 10pF @ 1V, 1MHz
• Current - Average Rectified (io): 200mA (DC)
• Product: Schottky Diodes
• Peak Reverse Voltage: 30 V
• Forward Continuous Current: 0.2 A
• Max Surge Current: 0.6 A
• Configuration: Single
• Forward Voltage Drop: 0.8 V
• Maximum Reverse Leakage Current: 2 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 934057248315::BAT54L T/R::BAT54L T/R

NXP Semiconductors
ELECTRICAL CHARACTERISTICS
T
Note
1. Pulse test: t
THERMAL CHARACTERISTICS
Note
1. Refer to SOD882 standard mounting conditions (footprint), FR4 printed-circuit board with 60 μm copper strip line.
Soldering
Reflow soldering is the only recommended soldering method.
2003 Jun 23
V
I
C
R
amb
SYMBOL
R
SYMBOL
F
Schottky barrier diode
d
th j-a
= 25 °C unless otherwise specified.
forward voltage
continuous reverse current
diode capacitance
thermal resistance from junction to ambient
p
= 300 μs; δ = 0.02.
PARAMETER
PARAMETER
3
see Fig.2
V
V
note 1
R
R
I
I
I
I
I
F
F
F
F
F
= 25 V; see Fig.3; note 1
= 1 V; f = 1 MHz; see Fig.4
= 0.1 mA
= 1 mA
= 10 mA
= 30 mA
= 100 mA
CONDITIONS
CONDITIONS
240
320
400
500
800
2
10
VALUE
MAX.
Product data sheet
500
BAT54L
mV
mV
mV
mV
mV
μA
pF
UNIT
UNIT
K/W