BAT54L,315 NXP Semiconductors, BAT54L,315 Datasheet - Page 3
![DIODE SCHOTTKY 30V 200MA SOD882](/photos/5/27/52797/sod-882_sml.jpg)
BAT54L,315
Manufacturer Part Number
BAT54L,315
Description
DIODE SCHOTTKY 30V 200MA SOD882
Manufacturer
NXP Semiconductors
Datasheet
1.BAT54L315.pdf
(7 pages)
Specifications of BAT54L,315
Package / Case
SOD-882
Mounting Type
Surface Mount
Speed
Small Signal =< 200mA (Io), Any Speed
Current - Reverse Leakage @ Vr
2µA @ 25V
Voltage - Forward (vf) (max) @ If
800mV @ 100mA
Voltage - Dc Reverse (vr) (max)
30V
Capacitance @ Vr, F
10pF @ 1V, 1MHz
Current - Average Rectified (io)
200mA (DC)
Product
Schottky Diodes
Peak Reverse Voltage
30 V
Forward Continuous Current
0.2 A
Max Surge Current
0.6 A
Configuration
Single
Forward Voltage Drop
0.8 V
Maximum Reverse Leakage Current
2 uA
Operating Temperature Range
+ 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
934057248315::BAT54L T/R::BAT54L T/R
NXP Semiconductors
ELECTRICAL CHARACTERISTICS
T
Note
1. Pulse test: t
THERMAL CHARACTERISTICS
Note
1. Refer to SOD882 standard mounting conditions (footprint), FR4 printed-circuit board with 60 μm copper strip line.
Soldering
Reflow soldering is the only recommended soldering method.
2003 Jun 23
V
I
C
R
amb
SYMBOL
R
SYMBOL
F
Schottky barrier diode
d
th j-a
= 25 °C unless otherwise specified.
forward voltage
continuous reverse current
diode capacitance
thermal resistance from junction to ambient
p
= 300 μs; δ = 0.02.
PARAMETER
PARAMETER
3
see Fig.2
V
V
note 1
R
R
I
I
I
I
I
F
F
F
F
F
= 25 V; see Fig.3; note 1
= 1 V; f = 1 MHz; see Fig.4
= 0.1 mA
= 1 mA
= 10 mA
= 30 mA
= 100 mA
CONDITIONS
CONDITIONS
240
320
400
500
800
2
10
VALUE
MAX.
Product data sheet
500
BAT54L
mV
mV
mV
mV
mV
μA
pF
UNIT
UNIT
K/W