BAT54T,115 NXP Semiconductors, BAT54T,115 Datasheet

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BAT54T,115

Manufacturer Part Number
BAT54T,115
Description
DIODE SCHOTTKY 200MA SOT416 SC75
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAT54T,115

Voltage - Forward (vf) (max) @ If
800mV @ 100mA
Voltage - Dc Reverse (vr) (max)
30V
Current - Average Rectified (io)
200mA (DC)
Current - Reverse Leakage @ Vr
2µA @ 25V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr)
5ns
Capacitance @ Vr, F
10pF @ 1V, 1MHz
Mounting Type
Surface Mount
Package / Case
EMT3 (SOT-416, SC-75-3)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
934063958115
1. Product profile
1.1 General description
1.2 Features
1.3 Applications
1.4 Quick reference data
Single planar Schottky barrier diode with an integrated guard ring for stress protection,
encapsulated in a SOT416 (SC-75) ultra small Surface-Mounted Device (SMD) plastic
package.
Table 1.
[1]
Symbol
I
V
V
F
R
F
BAT54T
Single Schottky barrier diode
Rev. 01 — 14 December 2009
Low forward voltage: max. 400 mV
Low capacitance: max. 10 pF
Ultra small SMD plastic package
AEC-Q101 qualified
Ultra high-speed switching
Voltage clamping
Protection circuits
Blocking diode
Pulse test: t
Quick reference data
Parameter
forward current
reverse voltage
forward voltage
p
≤ 300 μs; δ ≤ 0.02.
Conditions
I
F
= 10 mA
[1]
Min
-
-
-
Typ
-
-
-
Product data sheet
Max
200
30
400
Unit
mA
V
mV

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BAT54T,115 Summary of contents

Page 1

BAT54T Single Schottky barrier diode Rev. 01 — 14 December 2009 1. Product profile 1.1 General description Single planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a SOT416 (SC-75) ultra small Surface-Mounted Device (SMD) ...

Page 2

... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number Package BAT54T 4. Marking Table 4. Type number BAT54T 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol FRM I FSM P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...

Page 3

... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Soldering point of cathode tab. 7. Characteristics Table 7. ° amb Symbol [1] Pulse test: t [2] When switched from I BAT54T_1 Product data sheet Thermal characteristics Parameter ...

Page 4

... NXP Semiconductors (1) (2) (mA (1) (2) (3) 1 − 0.4 = 125 °C (1) T amb = 85 °C (2) T amb = 25 °C (3) T amb Fig 1. Forward current as a function of forward voltage; typical values = 25 ° MHz; T amb Fig 3. Diode capacitance as a function of reverse voltage; typical values BAT54T_1 Product data sheet ...

Page 5

... NXP Semiconductors 8. Test information D.U.T. I Ω × ( 1mA R Fig 4. Reverse recovery time test circuit and waveforms 9. Package outline Fig 5. Package outline SOT416 (SC-75) BAT54T_1 Product data sheet SAMPLING OSCILLOSCOPE Ω mga881 input signal 1.8 1.4 3 1.75 0.9 1.45 0 Dimensions in mm Rev. 01 — 14 December 2009 ...

Page 6

... NXP Semiconductors 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description BAT54T [1] For further information and the availability of packing methods, see 11. Soldering Fig 6. Reflow soldering footprint SOT416 (SC-75) BAT54T_1 Product data sheet ...

Page 7

... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date BAT54T_1 20091214 BAT54T_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 14 December 2009 BAT54T Single Schottky barrier diode Supersedes - © NXP B.V. 2009. All rights reserved. ...

Page 8

... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

Page 9

... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 10 Packing information . . . . . . . . . . . . . . . . . . . . . 6 11 Soldering ...

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