PMEG6010ER,115 NXP Semiconductors, PMEG6010ER,115 Datasheet
PMEG6010ER,115
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PMEG6010ER,115 Summary of contents
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PMEG6010ER 1 A low V Rev. 01 — 9 March 2010 1. Product profile 1.1 General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD123W small and ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Type number PMEG6010ER 4. Marking Table 4. Type number PMEG6010ER 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol F(AV) I FSM P tot ...
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... NXP Semiconductors Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol amb T stg [1] Device mounted on a ceramic PCB °C prior to surge. [ [3] Reflow soldering is the only recommended soldering method. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. ...
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... NXP Semiconductors 3 10 duty cycle = Z th(j-a) (K/ 0.5 0.33 0.25 0.2 0.1 0.05 10 0.02 0. −1 10 −3 − FR4 PCB, standard footprint Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values th(j-a) duty cycle = (K/ 0.75 0.5 0.33 ...
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... NXP Semiconductors th(j-a) (K/W) duty cycle = 0.75 0.5 0.33 0.25 0.2 10 0.1 0.05 0.02 0. −1 10 −3 − Ceramic PCB standard footprint 2 3 Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 7. Characteristics Table 7. ° Symbol PMEG6010ER_1 Product data sheet − ...
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... NXP Semiconductors (A) 1 (1) (2) −1 10 (3) (4) (5) −2 10 −3 10 −4 10 0.0 0.2 0.4 = 150 °C ( 125 °C ( °C ( °C ( −40 °C ( Fig 4. Forward current as a function of forward voltage; typical values = 25 ° MHz; T amb Fig 6. Diode capacitance as a function of reverse voltage; typical values ...
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... NXP Semiconductors 0.7 P F(AV) (W) 0.6 0.5 0.4 (2) (1) 0.3 0.2 0.1 0.0 0.0 0.5 = 150 ° (1) δ = 0.1 (2) δ = 0.2 (3) δ = 0.5 (4) δ Fig 7. Average forward power dissipation as a function of average forward current; typical values 1.6 (1) I F(AV) (A) 1.2 (2) 0.8 (3) (4) ...
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... NXP Semiconductors 1.6 (1) I F(AV) (A) 1.2 (2) 0.8 (3) (4) 0.4 0 100 Ceramic PCB standard footprint 150 ° (1) δ (2) δ kHz (3) δ kHz (4) δ kHz Fig 11. Average forward current as a function of ambient temperature; typical values PMEG6010ER_1 Product data sheet 006aab897 1.6 I F(AV) (A) 1.2 ...
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... NXP Semiconductors 8. Test information Fig 13. Duty cycle definition The current ratings for the typical waveforms as shown in calculated according to the equations RMS 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications ...
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... NXP Semiconductors 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number PMEG6010ER [1] For further information and the availability of packing methods, see 11. Soldering Fig 15. Reflow soldering footprint SOD123W PMEG6010ER_1 Product data sheet Packing methods ...
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... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date PMEG6010ER_1 20100309 PMEG6010ER_1 Product data sheet 1 A low V Data sheet status Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 — 9 March 2010 PMEG6010ER MEGA Schottky barrier rectifier ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: PMEG6010ER_1 Product data sheet http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 01 — ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 Packing information ...