CMS02(TE12L) Toshiba, CMS02(TE12L) Datasheet

CMS02(TE12L)

Manufacturer Part Number

CMS02(TE12L)

Description

DIODE SCHOTTKY 30V 3A 3-4E1A

Manufacturer

Toshiba

Datasheet

1.CMS02TE12LQM.pdf (5 pages)

Specifications of CMS02(TE12L)

Voltage - Forward (vf) (max) @ If

400mV @ 3A

Voltage - Dc Reverse (vr) (max)

30V

Current - Average Rectified (io)

Current - Reverse Leakage @ Vr

500µA @ 30V

Diode Type

Schottky

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Mounting Type

Surface Mount

Package / Case

3-4E1A (M-Flat)

Lead Free Status / RoHS Status

Contains lead / RoHS non-compliant

Reverse Recovery Time (trr)

Capacitance @ Vr, F

Other names

CMS02TR

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Switching Mode Power Supply Applications

Portable Equipment Battery Applications

•

Absolute Maximum Ratings

Electrical Characteristics

Forward voltage: V

Average forward current: I

Repetitive peak reverse voltage: V

Suitable for compact assembly due to small surface-mount package

“M-FLAT

Repetitive peak reverse voltage

Average forward current

Peak one cycle surge forward current

(non-repetitive)

Junction temperature

Storage temperature

Note 1: Tℓ = 89.2°C: Rectangular waveform (α = 180°), V

Note 2: Using continuously under heavy loads (e.g. the application of

Peak forward voltage

Repetitive peak reverse current

Junction capacitance

Thermal resistance

high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to

decrease in the reliability significantly even if the operating conditions (i.e. operating

temperature/current/voltage, etc.) are within the absolute maximum ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Characteristics

” (Toshiba package name)

TOSHIBA Schottky Barrier Rectifier Trench Schottky Barrier Type

= 0.40 V (max)

F (AV)

(Ta = 25°C)

= 3.0 A

RRM

(Ta = 25°C)

Symbol

F (AV)

FSM

RRM

Symbol

= 30 V

stg

FM (1)

FM (2)

FM (3)

th (j-a)

RRM

th (j-ℓ)

CMS02

40 (50 Hz)

Device mounted on a ceramic board

(soldering land: 2 mm × 2 mm)

Device mounted on a glass-epoxy

board

(soldering land: 6 mm × 6 mm)

−40~125

−40~150

RRM

Rating

3.0

= 10 V, f = 1.0 MHz

= 0.5 A

= 1.0 A

= 3.0 A

(Note 1)

= 5 V

= 30 V

= 15 V

Test Condition

⎯

Unit

°C

Weight: 0.023 g (typ.)

JEDEC

JEITA

TOSHIBA

Min

⎯

Typ.

0.27

0.30

0.37

0.05

0.07

170

⎯

3-4E1A

2006-11-13

―

0.40

Max

135

0.5

⎯

CMS02

Unit: mm

°C/W

Unit

Related parts for CMS02(TE12L)

CMS02(TE12L) Summary of contents

Page 1

... Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc) ...

Page 2

Marking Abbreviation Code Part No. S2 CMS02 Standard Soldering Pad 1.4 3.0 Handling Precaution Schottky barrier diodes have reverse current characteristics compared to other diodes. There is a possibility SBD may cause thermal runaway when it is used under high ...

Page 3

F F 100 125°C 75°C 1 25°C 0.1 0.0 0.2 0.4 0.6 0.8 1.0 Instantaneous forward voltage max – (AV) Device mounted on a ceramic board (board size: ...

Page 4

Surge forward current (non-repetitive 25° Number of cycles I – 100 Pulse test ...

Page 5

... Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. • The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. • ...

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