MMDF1N05ER2G ON Semiconductor, MMDF1N05ER2G Datasheet

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MMDF1N05ER2G

Manufacturer Part Number
MMDF1N05ER2G
Description
MOSFET N-CHAN DUAL 2A 50V 8SOIC
Manufacturer
ON Semiconductor
Datasheet

Specifications of MMDF1N05ER2G

Fet Type
2 N-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
300 mOhm @ 1.5A, 10V
Drain To Source Voltage (vdss)
50V
Current - Continuous Drain (id) @ 25° C
2A
Vgs(th) (max) @ Id
3V @ 250µA
Gate Charge (qg) @ Vgs
12.5nC @ 10V
Input Capacitance (ciss) @ Vds
330pF @ 25V
Power - Max
2W
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Module Configuration
Dual
Transistor Polarity
N Channel
Continuous Drain Current Id
2A
Drain Source Voltage Vds
50V
On Resistance Rds(on)
300mohm
Rds(on) Test Voltage Vgs
10V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MMDF1N05ER2GOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MMDF1N05ER2G
Manufacturer:
ON/安森美
Quantity:
20 000
MMDF1N05E
Power MOSFET
1 Amp, 50 Volts
N−Channel SO−8, Dual
and true logic level performance. They are capable of withstanding
high energy in the avalanche and commutation modes and the
drain−to−source diode has a low reverse recovery time. MiniMOSt
devices are designed for use in low voltage, high speed switching
applications where power efficiency is important. Typical applications
are dc−dc converters, and power management in portable and battery
powered products such as computers, printers, cellular and cordless
phones. They can also be used for low voltage motor controls in mass
storage products such as disk drives and tape drives. The avalanche
energy is specified to eliminate the guesswork in designs where
inductive loads are switched and offer additional safety margin against
unexpected voltage transients.
Features
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Mounted on 2″ square FR4 board (1″ sq. 2 oz. Cu 0.06″ thick single sided) with
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 8
MAXIMUM RATINGS
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Drain Current − Continuous
Drain Current
Single Pulse Drain−to−Source Avalanche
Energy − Starting T
(V
Operating and Storage Temperature Range
Total Power Dissipation @ T
Thermal Resistance, Junction−to−Ambient
(Note 1)
Maximum Temperature for Soldering,
Time in Solder Bath
These miniature surface mount MOSFETs feature ultra low R
Ultra Low R
Logic Level Gate Drive − Can Be Driven by Logic ICs
Miniature SO−8 Surface Mount Package − Saves Board Space
Diode Is Characterized for Use In Bridge Circuits
Diode Exhibits High Speed
Avalanche Energy Specified
Mounting Information for SO−8 Package Provided
I
Pb−Free Package is Available
one die operating, 10 sec. max.
DD
DSS
= 25 V, V
Specified at Elevated Temperature
− Pulsed
GS
DS(on)
= 10 V, I
Rating
J
= 25°C
Provides Higher Efficiency and Extends Battery Life
(T
L
J
A
= 2 Apk)
= 25°C unless otherwise noted)
= 25°C
Symbol
T
R
J
V
V
E
I
P
, T
T
DM
I
qJA
DS
GS
AS
D
D
L
stg
−55 to 150
Value
± 20
62.5
300
260
2.0
2.0
50
10
10
1
DS(on)
°C/W
Unit
Sec
mJ
°C
°C
W
V
V
A
†For information on tape and reel specifications,
MMDF1N05ER2
MMDF1N05ER2G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
8
Device
(Note: Microdot may be in either location)
Source−1
Source−2
Gate−1
Gate−2
1
1 AMPERE, 50 VOLTS
ORDERING INFORMATION
G
F1N05 = Device Code
A
Y
WW
G
R
DS(on)
http://onsemi.com
PIN ASSIGNMENT
CASE 751
STYLE 11
N−Channel
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Pb−Free)
SO−8
Top View
Package
D
2
3
4
1
SO−8
SO−8
= 300 mW
Publication Order Number:
S
8
7
6
5
2,500/Tape & Reel
2,500/Tape & Reel
8
1
Drain−1
Drain−1
Drain−2
Drain−2
MMDF1N05E/D
MARKING
DIAGRAM
Shipping
AYWWG
F1N05
G

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MMDF1N05ER2G Summary of contents

Page 1

... P 2 °C/W R 62.5 qJA °C T 260 L 10 Sec MMDF1N05ER2 MMDF1N05ER2G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1 http://onsemi.com 1 AMPERE, 50 VOLTS R = 300 mW DS(on) N−Channel MARKING ...

Page 2

ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage = 250 mA Zero Gate Voltage Drain Current ( Gate−Body Leakage Current ( Vdc ...

Page 3

TYPICAL ELECTRICAL CHARACTERISTICS 25° DRAIN−TO−SOURCE VOLTAGE (VOLTS) DS Figure 1. On−Region Characteristics 0.5 0.4 0.3 0.2 0 ...

Page 4

1200 C iss C 1000 rss 800 600 400 200 GATE−TO−SOURCE OR DRAIN−TO−SOURCE VOLTAGE (VOLTS) Figure 7. Capacitance Variation SAFE OPERATING AREA INFORMATION Forward Biased Safe ...

Page 5

... *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. MiniMOS is a trademark of Semiconductor Components Industries, LLC (SCILLC). Company. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...

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