TDA1517ATWDH-T NXP Semiconductors, TDA1517ATWDH-T Datasheet - Page 10

• Manufacturer Part Number: TDA1517ATWDH-T
• Description: Audio Amplifiers W BTL/2X4 W SE AMP
• Manufacturer: NXP Semiconductors

Specifications of TDA1517ATWDH-T

• Product: Class-AB
• Output Power: 8 W
• Available Set Gain: 26 dB
• Thd Plus Noise: 0.03 %
• Operating Supply Voltage: 12 V
• Maximum Power Dissipation: 5000 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 8 Ohms
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 18 V
• Supply Voltage (min): 6 V
• Output Type: 1-Channel Mono or 2-Channel Stereo
• Package / Case: SOT-527
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TDA1517ATW/N1,118

NXP Semiconductors
Thermal behaviour (PCB design considerations)
The typical thermal resistance [R
HTSSOP20 package is 37 K/W if the IC is soldered on a
printed-circuit board with double sided 35 μm copper with
a minimum area of approximately 30 cm
usable thermal resistance depends strongly on the
mounting method of the device on the printed-circuit
board, the soldering method and the area and thickness of
the copper on the printed-circuit board.
The bottom ‘heat-spreader’ of the IC has to be soldered
efficiently on the ‘thermal land’ of the copper area of the
printed-circuit board using the re-flow solder technique.
A number of thermal vias in the ‘thermal land’ provide a
thermal path to the opposite copper site of the
printed-circuit board. The size of the surface layers should
be as large as needed to dissipate the heat.
2001 Apr 17
handbook, full pagewidth
8 W BTL or 2 × 4 W SE power amplifier
R
L = 30 mm plus vias
th(j-p)
curve is given for practical calculation purpose.
Fig.5 Thermal resistance of the HTSSOP20 mounted on printed-circuit board.
K/W
60
50
40
30
20
10
0
0
th(j-a)
] of the IC in the
2
. The actual
1
number of 35 μm copper layers
2
R th(j-a)
R th(j-p)
10
3
The thermal vias (0.3 mm ∅) in the ‘thermal land’ should
not use web construction techniques, because those will
have high thermal resistance; continuous connection
completely around the via-hole is recommended.
For a maximum ambient temperature of 60 °C the
following calculation can be made: for the application at
V
dissipation approximately 2.0 W;
T
Note: the above calculation holds for application at
‘average listening level’ music output signals. Applying (or
testing) with sine wave signals will produce approximately
twice the music power dissipation; at worst case condition
this can activate the maximum temperature protection.
j(max)
P
= 12 V and R
= T
4
amb
ON-BOARD-COOLING
+ P × R
COPPER DESIGN
L
CU-LAYER 2-4
CU-LAYER 1
= 8 Ω the (ALL-) music power
th(j-a)
MGU306
L
= 60 °C + 2.0 × 37 = 134 °C.
L
TDA1517ATW
Product specification