TDA8559TD NXP Semiconductors, TDA8559TD Datasheet - Page 33

• Manufacturer Part Number: TDA8559TD
• Description: Audio Amplifiers HEADPHONE AMP LV
• Manufacturer: NXP Semiconductors

Specifications of TDA8559TD

• Product: Class-AB
• Output Power: 140 mW
• Available Set Gain: 32 dB
• Thd Plus Noise: 0.05 %
• Operating Supply Voltage: 3 V
• Supply Current: 2.75 mA
• Maximum Power Dissipation: 1190 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Audio Load Resistance: 32 Ohms
• Input Bias Current (max): 300 nA
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Differential, Single
• Supply Type: Single
• Supply Voltage (max): 30 V
• Supply Voltage (min): 1.9 V
• Output Type: 1-Channel Mono or 2-Channel Stereo
• Package / Case: SOIC-16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TDA8559T/N1,512

Philips Semiconductors
TDA8559_3
Product data sheets
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These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 C
body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Rev. 03 — 15 May 2006
10 C measured in the atmosphere of the reflow oven. The package
Low-voltage stereo headphone amplifier
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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