IRF740ALPBF Vishay, IRF740ALPBF Datasheet - Page 2

MOSFET N-CH 400V 10A TO-262

IRF740ALPBF

Manufacturer Part Number
IRF740ALPBF
Description
MOSFET N-CH 400V 10A TO-262
Manufacturer
Vishay
Datasheets

Specifications of IRF740ALPBF

Transistor Polarity
N-Channel
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
550 mOhm @ 6A, 10V
Drain To Source Voltage (vdss)
400V
Current - Continuous Drain (id) @ 25° C
10A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
36nC @ 10V
Input Capacitance (ciss) @ Vds
1030pF @ 25V
Power - Max
3.1W
Mounting Type
Through Hole
Package / Case
I²Pak, TO-262 (3 straight leads + tab)
Minimum Operating Temperature
- 55 C
Configuration
Single
Resistance Drain-source Rds (on)
0.55 Ohm @ 10 V
Drain-source Breakdown Voltage
400 V
Gate-source Breakdown Voltage
+/- 30 V
Continuous Drain Current
10 A
Power Dissipation
3100 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Continuous Drain Current Id
10A
Drain Source Voltage Vds
400V
On Resistance Rds(on)
550mohm
Rds(on) Test Voltage Vgs
10V
Threshold Voltage Vgs Typ
4V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
*IRF740ALPBF

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF740ALPBF
Manufacturer:
VISHAY/威世
Quantity:
20 000
Company:
Part Number:
IRF740ALPBF
Quantity:
10 000
Company:
Part Number:
IRF740ALPBF
Quantity:
70 000
Diode Characteristics
Dynamic @ T
Avalanche Characteristics
Thermal Resistance
Document Number: 91052
Static @ T
E
I
E
R
R
V
∆V
R
V
I
I
g
Q
Q
Q
t
t
t
t
C
C
C
C
C
C
I
I
V
t
Q
t
AR
DSS
GSS
d(on)
r
d(off)
f
SM
S
rr
on
fs
AS
AR
(BR)DSS
DS(on)
GS(th)
θJC
θJA
iss
oss
rss
oss
oss
oss
SD
g
gs
gd
rr
(BR)DSS
eff.
/∆T
J
Breakdown Voltage Temp. Coefficient
Drain-to-Source Breakdown Voltage
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Output Capacitance
Output Capacitance
Effective Output Capacitance
Drain-to-Source Leakage Current
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) 
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Forward Turn-On Time
J
= 25°C (unless otherwise specified)
J
Single Pulse Avalanche Energy‚†
Avalanche Current
Repetitive Avalanche Energy
Junction-to-Case
Junction-to-Ambient ( PCB Mounted, steady-state)*
= 25°C (unless otherwise specified)
Parameter
Parameter
Parameter
Parameter
Parameter
–––
400
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Min. Typ. Max. Units
2.0
Min. Typ. Max. Units
4.9
Min. Typ. Max. Units
–––
–––
–––
–––
–––
Intrinsic turn-on time is negligible (turn-on is dominated by L
0.48
1030 –––
1490 –––
–––
––– 0.55
–––
–––
–––
–––
––– -100
–––
–––
–––
–––
170
–––
–––
–––
240
7.7
1.9
10
35
24
22
52
61
–––
–––
250
100
–––
–––
–––
–––
–––
–––
–––
–––
–––
360
4.0
9.9
2.9
2.0
25
36
16
10
40
µA
nA
nC
ns
µC
pF
ns
V
V
S
V
Typ.
–––
–––
–––
Typ.
–––
–––
I
V
V
V
V
V
V
V
V
V
V
V
I
R
R
V
V
ƒ = 1.0MHz, See Fig. 5†
V
V
V
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
T
di/dt = 100A/µs „†
V/°C
D
D
GS
GS
DS
DS
DS
GS
GS
DS
DS
GS
DD
G
D
GS
DS
GS
GS
GS
J
J
= 10A
= 10A
= 25°C, I
= 25°C, I
= 19.5Ω,See Fig. 10
= 10Ω
= V
= 400V, V
= 320V, V
= 320V
= 25V
= 0V, I
= 10V, I
= 30V
= -30V
= 50V, I
= 10V, See Fig. 6 and 13 „†
= 200V
= 0V
= 0V, V
= 0V, V
= 0V, V
Reference to 25°C, I
GS
, I
D
S
F
DS
D
D
D
DS
DS
Conditions
= 250µA
Conditions
Conditions
= 10A, V
= 10A
= 250µA
= 6.0A
= 6.0A†
GS
GS
= 0V to 320V …†
Max.
Max.
= 1.0V, ƒ = 1.0MHz
= 320V, ƒ = 1.0MHz
12.5
630
1.0
10
40
= 0V, T
= 0V
www.vishay.com
GS
J
= 0V „
G
„†
= 125°C
D
= 1mA†
Units
Units
S
°C/W
+L
mJ
mJ
A
D
S
D
)
2

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