IRFZ24NPBF International Rectifier, IRFZ24NPBF Datasheet
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Manufacturer Part Number
IRFZ24NPBF
Description
MOSFET N-CH 55V 17A TO-220AB
Manufacturer
International Rectifier
Specifications of IRFZ24NPBF
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
70 mOhm @ 10A, 10V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
17A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
20nC @ 10V
Input Capacitance (ciss) @ Vds
370pF @ 25V
Power - Max
45W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Current, Drain
17 A
Gate Charge, Total
20 nC
Package Type
TO-220AB
Polarization
N-Channel
Power Dissipation
45 W
Resistance, Drain To Source On
0.07 Ohm
Temperature, Operating, Maximum
+175 °C
Temperature, Operating, Minimum
-55 °C
Time, Turn-off Delay
19 ns
Time, Turn-on Delay
4.9 ns
Transconductance, Forward
4.5 S
Voltage, Breakdown, Drain To Source
55 V
Voltage, Forward, Diode
1.3 V
Voltage, Gate To Source
±20 V
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
55 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
17 A
Mounting Style
Through Hole
Gate Charge Qg
13.3 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
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www.irf.com
Fifth Generation
International Rectifier utilize advanced processing
techniques to achieve the lowest possible on-resistance
per silicon area. This benefit, combined with the fast
switching speed and ruggedized device design that HEXFET
power MOSFETs are well known for, provides the designer
with an extremely efficient device for use in a wide variety
of applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 watts. The low thermal resistance
and low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
θ
θ
θ
®
HEXFET
®
power MOSFETs
#
from
G
S
D
TO-220AB
DS(on)
DSS
D
Ω
1
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IRFZ24NPBF Summary of contents
... Fifth Generation HEXFET power MOSFETs International Rectifier utilize advanced processing techniques to achieve the lowest possible on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET power MOSFETs are well known for, provides the designer with an extremely efficient device for use in a wide variety of applications ...
Ω Ω ≤ ≤ ≤ ≤ Ω Ω, ≤ ≤ www.irf.com ...
VGS TOP 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V 10 4.5V 20µs PULSE WIDTH T = 25° 0 Drain-to-Source Voltage ( 100 T = 25° ...
1MHz iss 600 rss oss iss 500 C oss 400 300 ...
T , Case Temperature (° 0.50 1 0.20 0.10 0.05 0.02 0.01 0.1 SINGLE PULSE (THERMAL RESPONSE) 0.01 0.00001 0.0001 www.irf.com V 90% A 125 150 ...
V DS D.U. Charge 6 L 140 120 + 100 0.01Ω V (BR)DSS V DD TOP BOTTOM ...
Driver Gate Drive D.U.T. I Reverse Recovery Current D.U.T. V Re-Applied Voltage Inductor Curent www.irf.com + • • • • • • • Period D = P.W. Waveform SD Body Diode Forward Current ...
Dimensions are shown in millimeters (inches) 2.87 (.113) 2.62 (.103) 15.24 (.600) 14.84 (.584) 14.09 (.555) 13.47 (.530) 1.40 (.055) 3X 1.15 (.045) 2.54 (.100) 2X NOTES: 1 DIMENSIONING & TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION : INCH ...
Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...
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