IPB04N03LA Infineon Technologies, IPB04N03LA Datasheet
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IPB04N03LA
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IPB04N03LA Summary of contents
Page 1
... Marking 04N03LA Symbol Conditions =25 ° =100 ° =25 °C D,pulse C =25 Ω = = = /dt di /dt =200 A/µs, T =175 °C j,max =25 °C tot stg page 1 IPB04N03LA (SMD version) 3.9 mΩ PG-TO263 Value Unit 385 290 mJ 6 kV/µs ±20 V 107 W -55 ... 175 °C 55/175/56 2006-05-10 ...
Page 2
... (BR)DSS =60 µA GS(th = DSS T =25 ° = =125 ° = GSS =4 = DS(on) SMD version SMD version |>2 DS(on)max = page 2 IPB04N03LA G Values Unit min. typ. max 1.4 K 1.2 1 0.1 1 µ 100 - 10 100 nA - 5.1 6.4 mΩ - 3.2 3.9 Ω 2006-05-10 ...
Page 3
... Symbol Conditions C iss = oss f =1 MHz C rss t d( =2.7 Ω d(off g( plateau V =0 g(sync = oss =25 ° S,pulse = =25 ° = /dt =400 A/µs F page 3 IPB04N03LA G Values Unit min. typ. max. - 2915 3877 pF - 1236 1643 - 175 263 - 4.5 7 5.4 8 4.6 6 385 - 0.96 1 2006-05-10 ...
Page 4
... Drain current I =f 100 100 150 200 0 [° Max. transient thermal impedance Z =f(t thJC p parameter µs 10 µs 1 100 µs 0 0.01 0.001 10 100 10 0 [V] DS page 4 IPB04N03LA G ≥ 100 150 T [° 0.5 0.2 0.1 0.05 0.02 0.01 single pulse - [s] p 200 0 10 ...
Page 5
... T j 160 140 120 100 175 ° Rev. 1.7 6 Typ. drain-source on resistance R =f(I DS(on) parameter Typ. forward transconductance g =f 120 100 ° [V] GS page 5 IPB04N03LA =25 ° 3 3.5 V 3 100 120 I [A] D =25 ° [A] D 140 80 2006-05-10 ...
Page 6
... GS(th) parameter: I 2.5 2 1.5 typ 1 0 100 140 180 -60 [° Forward characteristics of reverse diode I =f parameter Ciss Crss [V] DS page 6 IPB04N03LA 600 µA 60 µA - 100 140 T [° 25°C 98% 25 °C 175 °C 175°C 98% 0 0.5 1 1.5 V [V] SD 180 2 2006-05-10 ...
Page 7
... AV GS parameter: T j(start) 100 150 ° Drain-source breakdown voltage V =f BR(DSS -60 - Rev. 1.7 14 Typ. gate charge V =f(Q GS parameter °C 100 ° 100 1000 [µ Gate charge waveforms s(th) Q g(th) 60 100 140 180 [°C] j page 7 IPB04N03LA =40 A pulsed gate [nC] gate ate 2006-05-10 ...
Page 8
... PG-TO263-3-2/TO263-3-5/TO263-3-22: Outlines Footprint Rev. 1.7 Packaging page 8 IPB04N03LA G 2006-05-10 ...
Page 9
... Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.7 page 9 IPB04N03LA G 2006-05-10 ...