NDS9407 Fairchild Semiconductor, NDS9407 Datasheet - Page 2

• Manufacturer Part Number: NDS9407
• Description: MOSFET P-CH 60V 3A 8-SOIC
• Manufacturer: Fairchild Semiconductor
• Series: PowerTrench®r

Specifications of NDS9407

• Fet Type: MOSFET P-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 150 mOhm @ 3A, 10V
• Drain To Source Voltage (vdss): 60V
• Current - Continuous Drain (id) @ 25° C: 3A
• Vgs(th) (max) @ Id: 3V @ 250µA
• Gate Charge (qg) @ Vgs: 22nC @ 10V
• Input Capacitance (ciss) @ Vds: 732pF @ 30V
• Power - Max: 1W
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Configuration: Single Quad Drain Triple Source
• Transistor Polarity: P-Channel
• Resistance Drain-source Rds (on): 78 m Ohms
• Drain-source Breakdown Voltage: - 60 V
• Gate-source Breakdown Voltage: +/- 20 V
• Continuous Drain Current: - 3 A
• Power Dissipation: 2.5 W
• Maximum Operating Temperature: + 175 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NDS9407TR

Notes:
1. R
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300 s, Duty Cycle < 2.0%
Electrical Characteristics
Symbol
Off Characteristics
BV
I
I
I
On Characteristics
V
R
I
g
Dynamic Characteristics
C
C
C
Switching Characteristics
t
t
t
t
t
Q
Q
Q
Q
Drain–Source Diode Characteristics and Maximum Ratings
I
V
the drain pins. R
DSS
GSSF
GSSR
D(on)
d(on)
r
d(off)
f
rr
S
FS
BV
V
GS(th)
SD
DS(on)
iss
oss
rss
rr
g
gs
gd
JA
GS(th)
DSS
T
T
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
DSS
J
J
Drain–Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate–Body Leakage, Forward
Gate–Body Leakage, Reverse
Gate Threshold Voltage
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
On–State Drain Current
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Turn–On Delay Time
Turn–On Rise Time
Turn–Off Delay Time
Turn–Off Fall Time
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
Total Gate Charge
Gate–Source Charge
Gate–Drain Charge
Maximum Continuous Drain–Source Diode Forward Current
Drain–Source Diode Forward
Voltage
JC
is guaranteed by design while R
Parameter
a) 50°C/W when
mounted on a 1in
pad of 2 oz copper
(Note 2)
(Note 2)
CA
2
is determined by the user's board design.
V
I
V
V
V
V
V
I
V
V
V
V
V
V
f = 1.0 MHz
V
V
I
d
V
V
V
T
D
D
F
iF
A
GS
DS
DS
GS
GS
DS
GS
GS
GS
GS
DS
DS
DD
GS
DS
GS
GS
= –3.0 A,
= –250 A, Referenced to 25 C
= –250 A, Referenced to 25 C
/d
= 25°C unless otherwise noted
= –10 V, I
= –48 V,
= –48 V, V
= V
= –15 V,
= –30 V,
= –30 V,
= 0 V,
= 20 V,
= –20 V,
= –10 V,
= –4.5 V,
= –10 V,
= –30 V,
= –10 V,
= –10 V
= 0 V,
t
= 100 A/µs
Test Conditions
GS
b) 105°C/W when
,
mounted on a .04 in
pad of 2 oz copper
I
D
S
GS
= –3.0 A, T
= –2.1 A
I
V
V
V
I
I
I
V
I
V
I
R
I
D
D
D
D
D
D
D
= 0V, T
GS
DS
DS
DS
GEN
GS
= –250 A
= –250 A
= –3.0 A
= –1.6 A
= –3.0 A
= –1 A,
= –3.0 A,
= 0 V
= 0 V
= –5 V
= 0 V
= 0 V,
= 6
J
2
(Note 2)
= 55 C
J
=125 C
Min Typ
–60
–12
–1
–1.6
–0.8
–45
122
732
2.2
3.3
78
99
86
38
11
10
10
24
66
16
8
4
8
c) 125°C/W when mounted
on a minimum pad.
Max Units
–100
–2.1
–1.2
–10
100
150
240
250
–1
–3
16
20
20
20
22
NDS9407 Rev B1(W)
mV/ C
mV/ C
m
nA
nA
pF
pF
pF
nS
nC
nC
nC
nC
ns
ns
ns
ns
V
V
A
S
A
V
A