TDA8359JU NXP Semiconductors, TDA8359JU Datasheet - Page 14

• Manufacturer Part Number: TDA8359JU
• Description: Video ICs FULL BDG VERT DEFL O/P CIRC
• Manufacturer: NXP Semiconductors
• Type: Full Bridge Vertical Deflection Output Circuitr

Specifications of TDA8359JU

• Maximum Operating Temperature: + 85 C
• Package / Case: SOT-523
• Minimum Operating Temperature: - 25 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TDA8359J/N2,112

Philips Semiconductors
PACKAGE OUTLINE
2002 Jan 21
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
Full bridge vertical deflection output circuit
in LVDMOS
DIMENSIONS (mm are the original dimensions)
UNIT
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D 1 may protrude 0.04 mm maximum.
mm
OUTLINE
VERSION
SOT523-1
A 2
2.7
2.3
(2)
0.80
0.65
b p
0.58
0.48
k
c
13.2
12.8
D
1
Z
(1)
D 1
6.2
5.8
IEC
(2)
D h
3.5
e
D 1
D
P
14.7
14.3
E
(1)
e 1
E h
3.5
JEDEC
2.54
b p
e
9
1.27
REFERENCES
e 1
0
q 2
5.08
w
e 2
M
E
3.0
2.0
k
non-concave
scale
EIAJ
12.4
11.0
14
L
5
11.4
10.0
L 1
x
6.7
5.5
L 2
10 mm
L
L 2
4.5
3.7
L 3
view B: mounting base side
B
L 3
Q
2.8
m
3.4
3.1
A 2
P
m
D h
1.15
0.85
Q
PROJECTION
EUROPEAN
17.5
16.3
e 2
q
E h
c
4.85
q 1
3.8
3.6
q 2
q
q 1
Product specification
L 1
0.8
TDA8359J
v
v
M
ISSUE DATE
0.3
98-11-12
00-07-03
w
0.02
SOT523-1
x
1.65
1.10
Z
(1)