IRF6709S2TRPBF International Rectifier, IRF6709S2TRPBF Datasheet - Page 3

• Manufacturer Part Number: IRF6709S2TRPBF
• Description: MOSFET N-CH 25V 12A DIRECTFET-S1
• Manufacturer: International Rectifier
• Series: HEXFET®r

Specifications of IRF6709S2TRPBF

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 3.8 mOhm @ 19A, 10V
• Drain To Source Voltage (vdss): 25V
• Current - Continuous Drain (id) @ 25° C: 19A
• Vgs(th) (max) @ Id: 2.35V @ 25µA
• Gate Charge (qg) @ Vgs: 20nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 1810pF @ 13V
• Power - Max: 2.2W
• Mounting Type: Surface Mount
• Package / Case: DirectFET™ Isometric S1
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 13.5 mOhms
• Drain-source Breakdown Voltage: 25 V
• Gate-source Breakdown Voltage: 20 V
• Continuous Drain Current: 39 A
• Power Dissipation: 21 W
• Gate Charge Qg: 8.1 nC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ƒ
„
ˆ
P
P
P
T
T
T
R
R
R
R
R
ƒ Surface mounted on 1 in. square Cu
board (still air).
Absolute Maximum Ratings
Thermal Resistance
Notes:
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling, mounting pad with large heatsink.
T
@T
@T
@T
C
measured with thermocouple incontact with top (Drain) of part.
A
A
C
= 25°C
= 70°C
= 25°C
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
0.20
0.10
0.05
0.01
0.02
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
(At lower pulse widths Zth
0.0001
fl
f
jl
kl
l
Parameter
Parameter
Ã
0.001
t 1 , Rectangular Pulse Duration (sec)
‰ Mounted on minimum footprint full size board with metalized
τ
1
Ci= τi/Ri
τ
1
Ci= τi/Ri
back and with small clip heatsink. (still air)
R
1
R
1
0.01
JA
τ
2
R
τ
& Zth
‰
Š
2
2
R
2
back and with small clip heatsink.
Mounted on minimum footprint full size board with metalized
R
R
τ
θ
3
3
R
τ
3
3
JC
is measured at
τ
are combined)
R
4
τ
0.1
4
R
4
4
τ
R
5
τ
5
R
5
5
τ
R
6
τ
6
R
6
6
T
τ
R
7
1
J
τ
7
R
7
7
Typ.
of approximately 90°C.
12.5
–––
–––
1.0
20
τ
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
R
8
τ
8
R
8
8
-55 to + 175
R
9
R
9
Max.
0.012
τ
10
A
270
1.8
1.3
τ
21
A
4.48E+00
2.96E+00
1.23E+01
3.63E+01
2.45E+01
Ri (°C/W)
3.82E-03
2.77E-01
6.99E-01
2.47E-01

Max.
–––
–––
–––
7.2
82
100
2.39E+00
1.58E+00
6.58E+00
1.94E+01
2.04E-03
1.48E-01
3.72E-01
1.32E-01
τi (sec)
13.06
1000
Units
Units
°C/W
W/°C
°C
W
3