NTD4810N-35G ON Semiconductor, NTD4810N-35G Datasheet - Page 2

MOSFET N-CH 30V 8.6A IPAK

NTD4810N-35G

Manufacturer Part Number
NTD4810N-35G
Description
MOSFET N-CH 30V 8.6A IPAK
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTD4810N-35G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
10 mOhm @ 30A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
8.6A
Vgs(th) (max) @ Id
2.5V @ 250µA
Gate Charge (qg) @ Vgs
11nC @ 4.5V
Input Capacitance (ciss) @ Vds
1350pF @ 12V
Power - Max
1.28W
Mounting Type
Through Hole
Package / Case
IPak, TO-251, DPak (3 straight short leads + tab)
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.01 Ohms
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
10.8 A
Power Dissipation
2 W
Maximum Operating Temperature
+ 175 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTD4810N-35G
Manufacturer:
ON
Quantity:
12 500
1. Surface--mounted on FR4 board using 1 in sq pad size, 1 oz Cu.
2. Surface--mounted on FR4 board using the minimum recommended pad size.
3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
4. Switching characteristics are independent of operating junction temperatures.
OFF CHARACTERISTICS
ON CHARACTERISTICS (Note 3)
CHARGES AND CAPACITANCES
SWITCHING CHARACTERISTICS (Note 4)
THERMAL RESISTANCE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
Junction--to--Case (Drain)
Junction--to--TAB (Drain)
Junction--to--Ambient -- Steady State (Note 1)
Junction--to--Ambient -- Steady State (Note 2)
Drain--to--Source Breakdown Voltage
Drain--to--Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate--to--Source Leakage Current
Gate Threshold Voltage
Negative Threshold Temperature Coefficient
Drain--to--Source On Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Threshold Gate Charge
Gate--to--Source Charge
Gate--to--Drain Charge
Total Gate Charge
Turn--On Delay Time
Rise Time
Turn--Off Delay Time
Fall Time
Turn--On Delay Time
Rise Time
Turn--Off Delay Time
Fall Time
Temperature Coefficient
Parameter
Parameter
(T
J
= 25°C unless otherwise noted)
V
V
V
(BR)DSS
Symbol
Q
Q
V
GS(TH)
R
Q
(BR)DSS
t
t
t
t
I
GS(TH)
C
G(TOT)
Q
G(TOT)
I
DS(on)
Q
C
C
g
d(on)
d(off)
d(on)
d(off)
GSS
G(TH)
DSS
oss
t
t
FS
rss
GS
GD
t
t
iss
r
f
r
f
/T
/T
J
http://onsemi.com
J
V
V
V
V
V
V
V
V
V
GS
V
GS
DS
V
V
GS
GS
GS
DS
GS
GS
11.5 V
V
I
I
GS
GS
D
D
GS
DS
= 4.5 V
= 10 to
2
= 24 V
= 11.5 V, V
= 15 A, R
= 11.5 V, V
= 15 A, R
= 0 V,
Test Condition
= 0 V, V
= 4.5 V, V
= 4.5 V, V
= V
= 0 V, f = 1.0 MHz,
= 0 V, I
= 15 V, I
V
I
I
DS
D
D
DS
= 30 A
= 30 A
, I
= 12 V
GS
D
D
G
G
D
DS
DS
= 250 mA
DS
DS
T
= 250 mA
= 3.0 Ω
= 3.0 Ω
T
= 20 V
I
I
I
I
J
= 10 A
D
D
D
D
J
= 15 V,
= 15 V,
= 125°C
= 15 V,
= 15 V,
= 25°C
= 30 A
= 15 A
= 30 A
= 15 A
Min
1.5
30
R
Symbol
θJC--TAB
R
R
R
θJC
θJA
θJA
1165
20.7
13.8
20.7
21.8
11.5
Typ
284
154
5.2
8.0
7.8
9.0
9.2
1.3
3.3
4.4
3.8
7.2
2.6
27
12
11
21
Value
117
3.0
3.5
75
100
1350
Max
15.7
330
200
1.0
2.5
10
10
11
°C/W
Unit
mV/°C
mV/°C
Unit
nC
nC
mA
nA
pF
ns
ns
V
V
S

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