IRL640S Vishay, IRL640S Datasheet - Page 2
![MOSFET N-CH 200V 17A D2PAK](/photos/5/29/52982/vishay-d2pak_sml.jpg)
IRL640S
Manufacturer Part Number
IRL640S
Description
MOSFET N-CH 200V 17A D2PAK
Manufacturer
Vishay
Datasheet
1.IRL640S.pdf
(8 pages)
Specifications of IRL640S
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
180 mOhm @ 10A, 5V
Drain To Source Voltage (vdss)
200V
Current - Continuous Drain (id) @ 25° C
17A
Vgs(th) (max) @ Id
2V @ 250µA
Gate Charge (qg) @ Vgs
66nC @ 5V
Input Capacitance (ciss) @ Vds
1800pF @ 25V
Power - Max
3.1W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRL640S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
IRL640STRLPBF
Manufacturer:
VISHAY
Quantity:
5 737
IRL640S, SiHL640S
Vishay Siliconix
Note
a. When mounted on 1" square PCB (FR-4 or G-10 material).
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width 300 μs; duty cycle 2 %.
www.vishay.com
2
Maximum Junction-to-Ambient
Maximum Junction-to-Ambient
(PCB Mount)
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Case (Drain)
SPECIFICATIONS (T
PARAMETER
Static
Drain-Source Breakdown Voltage
V
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Internal Drain Inductance
Internal Source Inductance
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulsed Diode Forward Current
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
DS
Temperature Coefficient
a
J
= 25 °C, unless otherwise noted)
a
SYMBOL
SYMBOL
V
R
V
t
t
C
R
I
I
C
R
R
V
DS(on)
C
Q
Q
V
GS(th)
d(off)
I
GSS
DSS
d(on)
Q
DS
g
Q
L
t
L
SM
t
I
t
t
on
DS
oss
SD
thJA
thJA
thJC
iss
rss
S
gs
gd
rr
fs
r
f
D
S
g
rr
/T
J
Between lead,
6 mm (0.25") from
package and center of
die contact
MOSFET symbol
showing the
integral reverse
p - n junction diode
V
V
V
T
GS
GS
GS
J
V
R
= 25 °C, I
DS
Intrinsic turn-on time is negligible (turn-on is dominated by L
g
T
= 5.0 V
= 4.0 V
= 5.0 V
Reference to 25 °C, I
J
= 4.6 , R
MIN.
= 160 V, V
= 25 °C, I
-
-
-
V
V
V
V
V
f = 1.0 MHz, see fig. 5
TEST CONDITIONS
DD
DS
DS
GS
DS
= 200 V, V
= 100 V, I
F
= V
= 0 V, I
= 50 V, I
V
V
= 17 A, dI/dt = 100 A/μs
V
GS
DS
D
S
GS
GS
GS
I
D
= 5.7 , see fig. 10
= 17 A, V
= ± 10 V
= 25 V,
, I
= 0 V,
= 17 A, V
see fig. 6 and 13
= 0 V, T
D
D
D
= 250 μA
= 250 μA
D
I
GS
I
D
= 10 A
D
= 17 A,
= 8.5 A
= 10 A
D
TYP.
= 0 V
GS
J
= 1 mA
-
-
-
DS
= 125 °C
G
G
b
= 0 V
= 160 V,
b
b
b
D
S
b
D
S
b
b
MIN.
200
1.0
MAX.
16
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.0
62
40
S10-2554-Rev. B, 08-Nov-10
Document Number: 91306
TYP.
1800
0.27
400
120
310
8.0
4.5
7.5
3.2
83
44
52
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MAX.
± 100
0.18
0.27
250
470
2.0
9.0
2.0
4.8
S
25
66
38
17
68
-
-
-
-
-
-
-
-
-
-
-
-
and L
UNIT
°C/W
D
UNIT
V/°C
)
nC
nH
μC
nA
μA
pF
ns
ns
S
A
V
V
V