NTB25P06T4G ON Semiconductor, NTB25P06T4G Datasheet - Page 5
![MOSFET P-CH 60V 27.5A D2PAK](/photos/5/31/53148/d__pak_to-263_418b___04_sml.jpg)
NTB25P06T4G
Manufacturer Part Number
NTB25P06T4G
Description
MOSFET P-CH 60V 27.5A D2PAK
Manufacturer
ON Semiconductor
Type
Power MOSFETr
Datasheet
1.NTB25P06.pdf
(6 pages)
Specifications of NTB25P06T4G
Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
82 mOhm @ 25A, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
27.5A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
50nC @ 10V
Input Capacitance (ciss) @ Vds
1680pF @ 25V
Power - Max
120W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Configuration
Single
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.082 Ohm @ 10 V
Forward Transconductance Gfs (max / Min)
13 S
Drain-source Breakdown Voltage
60 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
25 A
Power Dissipation
120000 mW
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Rohs Compliant
YES
Number Of Elements
1
Polarity
P
Channel Mode
Enhancement
Drain-source On-res
0.082Ohm
Drain-source On-volt
60V
Gate-source Voltage (max)
±15V
Operating Temp Range
-55C to 175C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
2 +Tab
Package Type
D2PAK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NTB25P06T4GOS
NTB25P06T4GOS
NTB25P06T4GOSTR
NTB25P06T4GOS
NTB25P06T4GOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NTB25P06T4G
Manufacturer:
FREESCALE
Quantity:
760
Company:
Part Number:
NTB25P06T4G
Manufacturer:
ON
Quantity:
800
Company:
Part Number:
NTB25P06T4G
Manufacturer:
ON
Quantity:
12 500
VARIABLE
CONFIGURATION
ZONE
M
VIEW W−W
SEATING
PLANE
−T−
F
1
1
G
−B−
4
2
L
3
D
0.13 (0.005)
10.66
0.42
*For additional information on our Pb−Free strategy and soldering
3 PL
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
M
S
R
VIEW W−W
M
F
T
2
PACKAGE DIMENSIONS
B
8.38
0.33
SOLDERING FOOTPRINT*
M
N
K
http://onsemi.com
CASE 418B−04
L
NTB25P06
C
17.02
ISSUE J
0.67
H
D
2
PAK
5
A
E
M
J
U
V
W
W
VIEW W−W
3.05
0.12
F
3
SCALE 3:1
1.016
0.04
P
L
inches
5.08
0.20
mm
NOTES:
1. DIMENSIONING AND TOLERANCING
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
PER ANSI Y14.5M, 1982.
NEW STANDARD 418B−04.
DIM
A
B
C
D
G
H
K
M
N
R
E
F
J
L
P
S
V
0.340
0.380
0.160
0.020
0.045
0.310
0.080
0.018
0.090
0.052
0.280
0.575
0.045
MIN
0.100 BSC
0.197 REF
0.079 REF
0.039 REF
INCHES
0.380
0.405
0.190
0.035
0.055
0.350
0.110
0.025
0.110
0.072
0.320
0.625
0.055
MAX
14.60
MILLIMETERS
MIN
8.64
9.65
4.06
0.51
1.14
7.87
2.03
0.46
2.29
1.32
7.11
1.14
2.54 BSC
5.00 REF
2.00 REF
0.99 REF
10.29
15.88
MAX
9.65
4.83
0.89
1.40
8.89
2.79
0.64
2.79
1.83
8.13
1.40