LM193AJ/883 National Semiconductor, LM193AJ/883 Datasheet - Page 15

• Manufacturer Part Number: LM193AJ/883
• Description: Comparator Dual ±18V/36V 8-Pin CDIP Rail
• Manufacturer: National Semiconductor

Specifications of LM193AJ/883

• Package: 8CDIP
• Typical Response Time: 1.3 us
• Typical Response Time Range: 0.5 to 5 us
• Typical Voltage Gain Range: 90 to 110 dB
• Output Type: Open Collector
• Number Of Channels Per Chip: 2
• Minimum Single Supply Voltage: 2 V
• Power Supply Type: Single|Dual
• Number Of Elements: 2
• Technology: Bipolar
• Input Offset Voltage: 2mV
• Input Bias Current (typ): 1nA
• Response Time: 1.3us
• Single Supply Voltage (typ): 3/5/9/12/15/18/24/28V
• Dual Supply Voltage (typ): ±3/±5/±9/±12/±15V
• Supply Current (max): 1@5VmA
• Power Supply Requirement: Single/Dual
• Common Mode Rejection Ratio: 60dB
• Voltage Gain In Db: 106.02dB
• Power Supply Rejection Ratio: 60dB
• Single Supply Voltage (min): 2V
• Single Supply Voltage (max): 36V
• Dual Supply Voltage (min): ±1V
• Dual Supply Voltage (max): ±18V
• Power Dissipation: 780mW
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Mounting: Through Hole
• Pin Count: 8
• Package Type: CDIP
• Lead Free Status / Rohs Status: Not Compliant

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.
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NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or
Physical Dimensions
NOTE: UNLESS OTHERWISE SPECIFIED
1. EPOXY COATING
2. 63Sn/37Pb EUTECTIC BUMP
3. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD.
4. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION REMAINING PINS ARE NUMBERED
COUNTERCLOCKWISE.
5. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X
PACKAGE HEIGHT.
6. REFERENCE JEDEC REGISTRATION MO-211, VARIATION BC.
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inches (millimeters) unless otherwise noted (Continued)
X
1
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= 1.514mm X
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8-Bump (12 mil) micro SMD Package
NS Package TLA08AAA
2
= 1.514mm X
2. A critical component is any component of a life
1
support device or system whose failure to perform
can be reasonably expected to cause the failure of
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IS PACKAGE WIDTH, X
3
= 0.600mm
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IS PACKAGE LENGTH AND X
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IS