BT258X-800R,127 NXP Semiconductors, BT258X-800R,127 Datasheet
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BT258X-800R,127
Specifications of BT258X-800R,127
BT258X-800R
BT258X-800R
Related parts for BT258X-800R,127
BT258X-800R,127 Summary of contents
Page 1
... CONDITIONS half sine wave ˚C hs all conduction angles half sine wave ˚C prior to j surge over any 20 ms period 1 Product specification BT258X series MAX. MAX. MAX. UNIT BT258X- 500R 600R 800R 500 600 800 SYMBOL a g MIN. MAX. -500R -600R -800R ...
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... D DRM(max) R RRM(max) j CONDITIONS 125 ˚C; DM DRM(max) j exponential waveform 100 mA DRM(max / 125 ˚C; D DRM(max / / Product specification BT258X series MIN. TYP. MAX. UNIT - - 2500 MIN. TYP. MAX. UNIT - - 5.0 K 6.9 K K/W MIN. TYP. MAX. UNIT - 50 200 1.3 1 0.4 1 ...
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... I p 10ms 1.4 1.2 0.8 0.6 0.4 100 150 , T(RMS Product specification BT258X series ITSM / initial = 25 C max 1 10 100 Number of half cycles at 50Hz , versus number of cycles, for TSM sinusoidal currents Hz. IT(RMS 0.01 0.1 1 surge duration / s , versus surge duration, for sinusoidal T(RMS) currents ...
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... Fig.11. Transient thermal impedance dVD/dt (V/us) 1000 100 10 1 100 150 (25˚C), Fig.12. Typical, critical rate of rise of off-state voltage Product specification BT258X series 125 typ max 0.04 0 without heatsink compound with heatsink compound 0.1ms 1ms 10ms 0. j-hs pulse width t . ...
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... Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8". October 2002 10.3 max 3.2 3.0 2.8 seating 15.8 19 max. max. plane 3 2 2.54 0.5 5.08 5 Product specification BT258X series 4.6 max 2.9 max 6.4 15.8 max 0.6 2.5 1.0 (2x) 0.9 0.7 1.3 Rev 2.000 ...
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... This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A 6 Product specification BT258X series Rev 2.000 ...