0750180014 Molex Inc, 0750180014 Datasheet - Page 5

• Manufacturer Part Number: 0750180014
• Description: Conn Board to Board HDR 108 POS 1.5mm Solder RA Thru-Hole Tray
• Manufacturer: Molex Inc
• Type: Board to Boardr
• Series: Plateau HS Dock™ 75018r

Specifications of 0750180014

• Pitch: 1.5 mm
• Number Of Rows: 3
• Number Of Contacts: 108
• Gender: HDR
• Contact Plating: Gold|Tin-Lead
• Termination Method: Solder
• Connector Type: Shrouded
• Number Of Positions: 108
• Number Of Positions Loaded: All
• Row Spacing: -
• Height Stacking (mating): -
• Molding Height Above Board: 0.424" (10.78mm)
• Contact Mating Length: -
• Mounting Type: Through Hole, Right Angle
• Termination: Solder
• Contact Finish: Gold
• Contact Finish Thickness: 30µin (0.76µm)
• Features: Board Guide
• Color: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

REVISION:
DOCUMENT NUMBER:
5.0 Application to PCB
C
This product is designed for Pin thru Paste attachment and recommended for convection or IR reflow processing.
Refer to the following sections for information on the proper solder stencil layout, reflow temperatures,
appropriate PCB thickness’s, and inspection of the attachment.
5.1 Recommended Stencil Layout:
AS-75005-001
ECR/ECN INFORMATION:
EC No:
DATE:
Note: The 2.00x2.00mm Apetures should be centered over the ground peg plated thru holes.
(Dimensions B and D are equivalent to Dimensions B and D on the Sales Drawings.)
UCP2003-2204
2003 / 04 / 09
APPLICATION SPECIFICATION
HIGH SPEED MEZZANINE
TITLE:
CREATED / REVISED BY:
12 Pair Stencil Shown for Reference
Ken Stiles
BOARD TO BOARD CONNECTOR SYSTEM
APPLICATION SPECIFICATION FOR THE
HIGH SPEED MEZZANINE
CHECKED BY:
Ken Stiles
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC
Manny Banakis
APPROVED BY:
SHEET No.
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