SI5326B-C-GM Silicon Laboratories Inc, SI5326B-C-GM Datasheet - Page 68

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SI5326B-C-GM

Manufacturer Part Number
SI5326B-C-GM
Description
ANY-RATE PRECISION CLOCK MULTIPLIER/JITTER ATTENUATOR, 2 OUT
Manufacturer
Silicon Laboratories Inc
Type
Clock Multiplierr
Datasheet

Specifications of SI5326B-C-GM

Pll
Yes
Input
Clock
Output
CML, CMOS, LVDS, LVPECL
Number Of Circuits
1
Ratio - Input:output
2:2
Differential - Input:output
Yes/Yes
Frequency - Max
808MHz
Divider/multiplier
Yes/Yes
Voltage - Supply
1.71 V ~ 3.63 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
36-QFN
Frequency-max
808MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
336-1745

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Manufacturer
Quantity
Price
Part Number:
SI5326B-C-GM
Manufacturer:
SIL
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Part Number:
SI5326B-C-GM
Manufacturer:
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Quantity:
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Part Number:
SI5326B-C-GMR
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Quantity:
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Part Number:
SI5326B-C-GMR
0
Si5326
68
Notes (General):
Notes (Solder Mask Design):
Notes (Stencil Design):
Notes (Card Assembly):
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
1. A stainless steel, laser-cut, and electro-polished stencil with trapezoidal walls should be
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
4. A 4 x 4 array of 0.80 mm square openings on 1.05 mm pitch should be used for the
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
used to assure good solder paste release.
center ground pad.
for Small Body Components.
Dimension
GD
GE
E2
D2
ZE
ZD
D
E
X
Y
e
Table 12. PCB Land Pattern Dimensions
Rev. 1.0
4.00
4.00
4.53
4.53
MIN
0.50 BSC.
5.42 REF.
5.42 REF.
0.89 REF.
MAX
4.20
4.20
0.28
6.31
6.31

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