MT46V16M16P-5B:K TR Micron Technology Inc, MT46V16M16P-5B:K TR Datasheet - Page 80
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MT46V16M16P-5B:K TR
Manufacturer Part Number
MT46V16M16P-5B:K TR
Description
DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.6V 66-Pin TSOP T/R
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet
1.MT46V16M16CY-5BK_TR.pdf
(93 pages)
Specifications of MT46V16M16P-5B:K TR
Package
66TSOP
Density
256 Mb
Address Bus Width
15 Bit
Operating Supply Voltage
2.6 V
Maximum Clock Rate
400 MHz
Maximum Random Access Time
0.7 ns
Operating Temperature
0 to 70 °C
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Figure 43:
PDF: 09005aef80768abb/Source: 09005aef82a95a3a
DDR_x4x8x16_Core2.fm - 256Mb DDR: Rev. O, Core DDR: Rev. B 1/09 EN
Command
Address
t
t
t
DQSS (NOM)
DQSS (MIN)
DQSS (MAX)
DQS
DQS
DQS
CK#
DM
DM
DM
DQ
DQ
DQ
CK
WRITE-to-READ – Interrupting
Notes:
Bank a,
WRITE
Col b
T0
t
t
t
DQSS
DQSS
DQSS
1. DI b = data-in for column b; DO n = data-out for column n.
2. An interrupted burst of 4 is shown; two data elements are written.
3. One subsequent element of data-in is applied in the programmed order following DI b.
4.
5. A10 is LOW with the WRITE command (auto precharge is disabled).
6. DQS is required at T2 and T2n (nominal case) to register DM.
7. If the burst of 8 is used, DM and DQS are required at T3 and T3n because the READ com-
t
mand will not mask these two data elements.
DI
WTR is referenced from the first positive CK edge after the last data-in pair.
b
NOP
T1
DI
b
DI
b
T1n
NOP
T2
t
WTR
T2n
78
Bank a,
READ
Col n
T3
T3n
Micron Technology, Inc., reserves the right to change products or specifications without notice.
CL = 2
CL = 2
CL = 2
T4
NOP
256Mb: x4, x8, x16 DDR SDRAM
Transitioning Data
T5
NOP
DO
DO
DO
©2003 Micron Technology, Inc. All rights reserved.
n
n
n
T5n
T6
NOP
Operations
Don’t Care
T6n
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