MT47H32M16HR-3 IT:F TR Micron Technology Inc, MT47H32M16HR-3 IT:F TR Datasheet - Page 60

DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA T/R

MT47H32M16HR-3 IT:F TR

Manufacturer Part Number
MT47H32M16HR-3 IT:F TR
Description
DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA T/R
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr

Specifications of MT47H32M16HR-3 IT:F TR

Density
512 Mb
Maximum Clock Rate
667 MHz
Package
84FBGA
Address Bus Width
15 Bit
Operating Supply Voltage
1.8 V
Maximum Random Access Time
0.45 ns
Operating Temperature
-40 to 85 °C
Organization
32Mx16
Address Bus
15b
Access Time (max)
450ps
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
250mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
Figure 24: Nominal Slew Rate for
Figure 25: Tangent Line for
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. R 12/10 EN
V
V
V
V
Hold slew rate
rising signal
IH(AC)min
IH(DC)min
IL(DC)max
IL(AC)max
V
V
V
REF(DC)
V
V
V
IH(AC)min
IH(DC)min
IL(DC)max
IL(AC)max
V
CK#
DDQ
REF(DC)
V
CK
V
t
SS
CK#
IH
DDQ
V
CK
SS
=
DC to V
DC to V
Tangent line (V
region
t
region
IH
REF
REF
REF[DC]
Nominal
slew rate
ΔTR
t IS
t IS
Tangent
line
- V
IL[DC]max
t IH
t IH
60
)
ΔTR
Hold slew rate
falling signal
ΔTR
Nominal
line
Micron Technology, Inc. reserves the right to change products or specifications without notice.
=
Tangent line (V
t IS
512Mb: x4, x8, x16 DDR2 SDRAM
Nominal
slew rate
Tangent
DC to V
DC to V
t IS
line
region
region
t IH
REF
REF
t IH
IH[DC]min
ΔTF
ΔTF
Nominal
Input Slew Rate Derating
line
ΔTF
- V
REF[DC]
)
© 2004 Micron Technology, Inc. All rights reserved.

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