PUMD2,165 NXP Semiconductors, PUMD2,165 Datasheet - Page 11

• Manufacturer Part Number: PUMD2,165
• Description: TRANS NPN/PNP 50V 100MA SOT363
• Manufacturer: NXP Semiconductors

Specifications of PUMD2,165

• Package / Case: SC-70-6, SC-88, SOT-363
• Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
• Current - Collector (ic) (max): 100mA
• Voltage - Collector Emitter Breakdown (max): 50V
• Resistor - Base (r1) (ohms): 22K
• Resistor - Emitter Base (r2) (ohms): 22K
• Dc Current Gain (hfe) (min) @ Ic, Vce: 60 @ 5mA, 5V
• Vce Saturation (max) @ Ib, Ic: 150mV @ 500µA, 10mA
• Current - Collector Cutoff (max): 1µA
• Power - Max: 300mW
• Mounting Type: Surface Mount
• Configuration: Dual
• Transistor Polarity: NPN/PNP
• Typical Input Resistor: 22 KOhms
• Typical Resistor Ratio: 1
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 50 V
• Peak Dc Collector Current: 100 mA
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Frequency - Transition: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934049950165; PUMD2 /T2; PUMD2 /T2

NXP Semiconductors
9. Packing information
10. Soldering
PEMD2_PIMD2_PUMD2_7
Product data sheet
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
[2]
[3]
Type number Package Description
PEMD2
PIMD2
PUMD2
Fig 14. Reflow soldering footprint PEMD2 (SOT666)
2
For further information and the availability of packing methods, see
T1: normal taping
T2: reverse taping
1.7
1.075
Reflow soldering is the only recommended soldering method.
Packing methods
0.538
SOT666
SOT457
SOT363
0.55
(2 )
Rev. 07 — 24 September 2008
NPN/PNP resistor-equipped transistors; R1 = 22 k , R2 = 22 k
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
0.45
(4 )
(4 )
0.5
2.75
2.45
2.1
1.6
1.7
PEMD2; PIMD2; PUMD2
0.65
(2 )
(2 )
0.6
(6 )
0.4
0.325
0.25
(2 )
(4 )
Section
0.375
(2 )
(4 )
[2]
[3]
[2]
[3]
0.3
[1]
Packing quantity
3000 4000 8000 10000
-
-
-115
-125
-115
-125
13.
Dimensions in mm
-
-115
-
-
-
-
© NXP B.V. 2008. All rights reserved.
-315
-
-
-
-
-
solder lands
placement area
solder paste
occupied area
sot666_fr
-
-
-135
-165
-135
-165
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