GNM1M2R71C104MA01D Murata, GNM1M2R71C104MA01D Datasheet - Page 155
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GNM1M2R71C104MA01D
Manufacturer Part Number
GNM1M2R71C104MA01D
Description
Manufacturer
Murata
Type
Ceramicr
Datasheet
1.GNM1M2R71C104MA01D.pdf
(220 pages)
Specifications of GNM1M2R71C104MA01D
Capacitance
.1uF
No. Of Capacitors
2
Tolerance (+ Or -)
20%
Voltage
16VDC
Number Of Terminals
4Terminal
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Package / Case
0504
Construction
SMT Chip
Failure Rate
Not Required
Product Height (mm)
0.6mm
Product Depth (mm)
1mm
Product Length (mm)
1.37mm
Lead Diameter (nom)
Not Requiredmm
Terminal Pitch
0.64mm
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GNM1M2R71C104MA01D
Manufacturer:
MURATA
Quantity:
640 000
Company:
Part Number:
GNM1M2R71C104MA01D
Manufacturer:
MURATA
Quantity:
240 000
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. PCB Design
1. Notice for Pattern Forms
Pattern Forms
and Leaded Components
Placing Close to Chassis
of Leaded Components
Notice
after Chip Component
of Chip Components
Soldering and Mounting
1-1. Unlike leaded components, chip components are
1-2. It is possible for the chip to crack by the expansion
Lateral Mounting
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
susceptible to flexing stresses since they are
mounted directly on the substrate.
They are also more sensitive to mechanical and
thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses
and cause chip cracking. When designing substrates,
take land patterns and dimensions into consideration
to eliminate the possibility of excess solder fillet
height.
and shrinkage of a metal board. Please contact us if
you want to use our ceramic capacitors on a metal
board such as Aluminum.
Placing
Placing
Electrode Pattern
Lead Wire
Solder (ground)
Prohibited
Chassis
Soldering Iron
Lead Wire
Solder Resist
Solder Resist
Solder Resist
Correct
Solder Resist
Continued on the following page.
Notice
153
C02E.pdf
09.9.18
8
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