GNM1M2R71C104MA01D Murata, GNM1M2R71C104MA01D Datasheet - Page 157
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GNM1M2R71C104MA01D
Manufacturer Part Number
GNM1M2R71C104MA01D
Description
Manufacturer
Murata
Type
Ceramicr
Datasheet
1.GNM1M2R71C104MA01D.pdf
(220 pages)
Specifications of GNM1M2R71C104MA01D
Capacitance
.1uF
No. Of Capacitors
2
Tolerance (+ Or -)
20%
Voltage
16VDC
Number Of Terminals
4Terminal
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Package / Case
0504
Construction
SMT Chip
Failure Rate
Not Required
Product Height (mm)
0.6mm
Product Depth (mm)
1mm
Product Length (mm)
1.37mm
Lead Diameter (nom)
Not Requiredmm
Terminal Pitch
0.64mm
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GNM1M2R71C104MA01D
Manufacturer:
MURATA
Quantity:
640 000
Company:
Part Number:
GNM1M2R71C104MA01D
Manufacturer:
MURATA
Quantity:
240 000
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
Table 3 GNM, LLA Series for Reflow Soldering Land Dimensions
Table 4 LLM Series for Reflow Soldering Land Dimensions
2. Adhesive Application
1. Thin or insufficient adhesive can cause the chips to
2. Low viscosity adhesive can cause chips to slip after
3. Adhesive Coverage
Notice
GNMpp2
LLM
loosen or become disconnected during flow soldering.
The amount of adhesive must be more than dimension c,
shown in the drawing at right, to obtain the correct
bonding strength.
The chip's electrode thickness and land thickness must
also be taken into consideration.
mounting. The adhesive must have a viscosity of
5000Pa
Continued from the preceding page.
GRM18, GQM18
GRM21, LLL21, GQM21
GRM31, LLL31
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Part Number
Part Number
Part Number
•
GNM0M2
GNM1M2
s (500ps) min. (at 25 C).
GNM212
GNM214
GNM314
e
LLA18
LLA21
LLA31
LLM21
LLM31
a
Chip Capacitor
c
p
Chip Capacitor
p
d
f
0.6 to 0.8
Adhesive Coverage*
Land
1.0
c
1.37
a
0.9
2.0
2.0
3.2
1.6
2.0
3.2
L
0.05mg min.
0.15mg min.
0.1mg min.
b'
a
b
b
b=(c-e)/2, b'=(d-f)/2
c'
*Nominal Value
(0.3 to 0.5)
(0.3 to 0.5)
b, b'
1.25
1.25
1.25
0.6
1.0
1.6
0.8
1.6
W
c, c'
0.3
0.4
0.12 to 0.20*
0.4 to 0.5
0.6 to 0.7
0.6 to 0.7
0.8 to 1.0
0.3 to 0.4
0.5 to 0.7
0.7 to 0.9
GNMpp4
LLA
a
Dimensions (mm)
Dimensions (mm)
* 0.82Va+2bV1.00
2.0 to 2.6
3.2 to 3.6
Board
d
0.35 to 0.40*
0.35 to 0.45
0.25 to 0.35
0.35 to 0.6
0.5 to 0.7
0.5 to 0.7
0.7 to 0.9
0.4 to 0.7
b
c
1.3 to 1.8
1.6 to 2.0
Chip Capacitor
Chip Capacitor
e
Land
p
Adhesive
0.25 to 0.35
0.15 to 0.25
0.3 to 0.35
0.4 to 0.5
0.3 to 0.4
0.2 to 0.3
0.3 to 0.4
Continued on the following page.
0.3
1.4 to 1.6
c
Land
2.6
f
a=20 to 70 m
b=30 to 35 m
c=50 to 105 m
a
b
a
b
Notice
0.45
0.64
c
1.0
0.5
0.8
0.4
0.5
0.8
p
0.5
0.8
p
155
C02E.pdf
09.9.18
8
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