C702 10M008 1214 Amphenol, C702 10M008 1214 Datasheet - Page 33
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C702 10M008 1214
Manufacturer Part Number
C702 10M008 1214
Description
Manufacturer
Amphenol
Type
Smart Cardr
Datasheet
1.C702_10M008_1214.pdf
(60 pages)
Specifications of C702 10M008 1214
Ejector Type
Pushmatic
Gender
HDR
Mounting Style
Through Hole
Termination Method
Solder
Body Orientation
Right Angle
Contact Pitch (mm)
2.54mm
Number Of Contact Rows
2
Number Of Contacts
16POS
Operating Temp Range
-25C to 85C
Insertion Force
12
Product Height (mm)
6.4mm
Product Depth (mm)
50.1mm
Product Length (mm)
64.5mm
Contact Pitch
2.54mm
Lead Free Status / RoHS Status
Compliant
C702E Smart Card Connectors with PCB Mount Wiping Contacts
C702E Smart Card Connectors with PCB Mount Wiping Contacts
Kondensator 0,1 F zwischen C1(VCC) und C5(GND) bei Kartenlage Chip oben
Capacitor 0,1 F between C1(VCC) and C5(GND) in card position chip up
13,1
8,7
3,5
6,7
8,2
7,5
2,9
4,5
2,9
8,6
Description
with board lock and
self-cleaning switch,
dual plane, 2 x 8 contacts,
acc. to EMV
Description
with board lock, self-cleaning
switch and card guide,
3 mm stand-offs, acc. to EMV
2
42
42,7
40
40
66
50,5
0,4
2,4
LAGE DER ABSTANDSBOLZEN
POSITION OF STAND - OFFS
24,5
Contact position Termination
ISO
(Data contacts top
and bottom side)
Contact position Termination
0,4
ISO
OBEN / UP
LEITERPLATTENDICKE / PCB THICKNESS = 1,4 ... 1,68
C5 C1
C6 C2
C7
C8
CHIP
2,54
5,08
BESTÜCKUNGSSEITE / COMPONENTS SIDE
BESTÜCKUNGSSEITE / COMPONENTS SIDE
C3
C4
ø3,2
LEITERPLATTENDICKE / PCB THICKNESS = 1,4 - 1,68
Dip solder pin
Dip solder pin
ø3,2
+0,1
-0,0
(2)
+0,1
C4
C3
C2
C1
-0,0
UNTEN / DOWN
S
S
10
S
C4
C3
C2
C1
S
17,3
CHIP
38,1
(40)
14
20
38,1
ø5
20
ø0,1
C8
C7
C6
C5
17,3
14
ø0,1
C8
C7
C6
C5
(66)
Part No.
C702 10M008 271 4
Part No.
C702 10M008 283 4
PLATZBEDARF ZAPFEN
SPACE FOR GUIDING PIN
33