BCR 108L3 E6327 Infineon Technologies, BCR 108L3 E6327 Datasheet

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BCR 108L3 E6327

Manufacturer Part Number
BCR 108L3 E6327
Description
TRANSISTOR NPN DGTL TSLP-3
Manufacturer
Infineon Technologies
Datasheet

Specifications of BCR 108L3 E6327

Transistor Type
NPN - Pre-Biased
Current - Collector (ic) (max)
100mA
Voltage - Collector Emitter Breakdown (max)
50V
Resistor - Base (r1) (ohms)
2.2K
Resistor - Emitter Base (r2) (ohms)
47K
Dc Current Gain (hfe) (min) @ Ic, Vce
70 @ 5mA, 5V
Vce Saturation (max) @ Ib, Ic
300mV @ 500µA, 10mA
Frequency - Transition
170MHz
Power - Max
250mW
Mounting Type
Surface Mount
Package / Case
TSLP-3-4
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
BCR108L3E6327XT
SP000014758
NPN Silicon Digital Transistor
BCR108/F/L3
BCR108T/W
Type
BCR108
BCR108F
BCR108L3
BCR108S
BCR108T
BCR108W
Built in bias resistor (R
Switching circuit, inverter, interface circuit,
BCR108S: Two internally isolated
BCR108S: For orientation in reel see
driver circuit
transistors with good matching
in one multichip package
package information below
1
B
R
1
R
2
C
3
E
EHA07184
2
BCR108S
TR1
C1
E1
6
1
R
R
2
1
1
B2
B1
5
2
=2.2 k , R
R
R
1
2
E2
C2
4
3
EHA07174
TR2
Marking
WHs
WHs
WH
WHs
WH
WHs
2
=47 k )
1=B
1=B
1=B
1=E1
1=B
1=B
2=E
2=E
2=E
2=B1
2=E
2=E
1
Pin Configuration
3=C
3=C
3=C
3=C2
3=C
3=C
-
-
-
4=E2
-
-
-
-
-
5=B2
-
-
-
-
-
6=C1
-
-
BCR108...
Package
SOT23
TSFP-3
TSLP-3-4
SOT363
SC75
SOT323
2006-05-04

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BCR 108L3 E6327 Summary of contents

Page 1

NPN Silicon Digital Transistor Switching circuit, inverter, interface circuit, driver circuit Built in bias resistor (R =2 BCR108S: Two internally isolated transistors with good matching in one multichip package BCR108S: For orientation in reel see package ...

Page 2

Maximum Ratings Parameter Collector-emitter voltage Collector-base voltage Input forward voltage Input reverse voltage Collector current Total power dissipation- BCR108, T 102°C S BCR108F, T 128°C S BCR108L3, T 135°C S BCR108S, T 115°C S BCR108T, T 109°C S BCR108W, T ...

Page 3

Electrical Characteristics at T Parameter DC Characteristics Collector-emitter breakdown voltage I = 100 µ Collector-base breakdown voltage = 10 µ Collector-base cutoff current ...

Page 4

DC current gain (common emitter configuration Input on Voltage (on 0.3V (common emitter ...

Page 5

Total power dissipation P BCR108 300 mW 250 225 200 175 150 125 100 Total power dissipation P BCR108L3 300 mW 250 225 200 175 150 125 100 75 50 ...

Page 6

Total power dissipation P BCR108T 300 mW 250 225 200 175 150 125 100 Permissible Pulse Load R BCR108 0.5 0.2 0.1 0.05 ...

Page 7

Permissible Puls Load R thJS BCR108F 2 10 K/W D=0 0.2 0.1 0.05 0.02 0.01 0.005 Permissible Puls Load R thJS BCR108L3 ...

Page 8

Permissible Puls Load R thJS BCR108S 0.5 0.2 0.1 0.05 0. 0.01 0.005 Permissible Puls Load R thJS ...

Page 9

Permissible Puls Load R thJS BCR108W 0.5 0.2 0.1 0.05 0. 0.01 0.005 Permissible Pulse ...

Page 10

Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package SC75 1.6 ±0.2 +0.1 0.2 0.1 MAX. -0. +0.1 0.2 -0.05 0.5 ...

Page 11

Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 Month ...

Page 12

Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package SOT23 2.9 ±0 +0.1 0.4 -0.05 C 0.95 1.9 0.25 B ...

Page 13

Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Package SOT323 2 ±0.2 0.1 MAX. +0.1 3x 0.3 -0.05 0 0.65 0.65 0.2 0.6 ...

Page 14

Package Outline Pin 1 marking Foot Print Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. Pin 1 marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = ...

Page 15

Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package TSFP-3 1.2 ±0.05 0.2 0.55 ±0.05 ±0. 0.2 0.15 ±0.05 0.4 ±0.05 0.4 ...

Page 16

Package Outline Top view Pin 1 marking 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" 0.6 0.225 0.15 Copper Marking Layout Standard Packing Reel ø180 mm = ...

Page 17

... For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system ...

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