BTA2008-600D,412 NXP Semiconductors, BTA2008-600D,412 Datasheet - Page 5

• Manufacturer Part Number: BTA2008-600D,412
• Description: TRIAC 600V 80MA TO-92
• Manufacturer: NXP Semiconductors

Specifications of BTA2008-600D,412

• Package / Case: TO-92-3 (Standard Body), TO-226
• Triac Type: Logic - Sensitive Gate
• Mounting Type: Through Hole
• Configuration: Single
• Current - Hold (ih) (max): 10mA
• Voltage - Off State: 600V
• Current - Gate Trigger (igt) (max): 5mA
• Current - Non Rep. Surge 50, 60hz (itsm): 9A, 10A
• Current - On State (it (rms)) (max): 800mA
• Voltage - Gate Trigger (vgt) (max): 2V
• Current - On State (it (rms) (max): 800mA
• Rated Repetitive Off-state Voltage Vdrm: 600 V
• Breakover Current Ibo Max: 9.9 A
• On-state Rms Current (it Rms): 0.8 A
• Off-state Leakage Current @ Vdrm Idrm: 0.1 mA
• Gate Trigger Voltage (vgt): 0.3 V
• Gate Trigger Current (igt): 5 mA
• Holding Current (ih Max): 10 mA
• Forward Voltage Drop: 1.35 V
• Mounting Style: Through Hole
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Repetitive Peak Forward Blocking Voltage: 600 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 934061106412; BTA2008-600D; BTA2008-600D

NXP Semiconductors
5. Thermal characteristics
Table 4.
BTA2008_SER_D_E_1
Product data sheet
Symbol
R
R
Fig 6.
th(j-lead)
th(j-a)
Z
th(j-lead)
(K/W)
10
10
10
10
1
1
2
2
Transient thermal impedance from junction to lead as a function of pulse duration
10
Thermal characteristics
5
Parameter
thermal resistance from junction to
lead
thermal resistance from junction to
ambient
10
4
10
3
Rev. 01 — 18 January 2008
Conditions
full cycle; see
printed circuit board
mounted; lead length 4 mm
10
2
Figure 6
BTA2008 series D and E
0.8 A Three-quadrant triacs high commutation
10
1
Min
-
-
Typ
-
150
P
1
t
p
© NXP B.V. 2008. All rights reserved.
t
p
(s)
Max
60
-
003aac206
t
10
Unit
K/W
K/W
5 of 12