MPC9443FA IDT, Integrated Device Technology Inc, MPC9443FA Datasheet - Page 9

• Manufacturer Part Number: MPC9443FA
• Manufacturer: IDT, Integrated Device Technology Inc
• Type: Clock Dividerr

Specifications of MPC9443FA

• Number Of Clock Inputs: 3
• Output Frequency: 350MHz
• Output Logic Level: LVCMOS
• Operating Supply Voltage (min): 2.375V
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.465V
• Package Type: LQFP
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Signal Type: LVCMOS/LVPECL
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / RoHS Status: Not Compliant

IDT™ / ICS™ LVCMOS CLOCK FANOUT BUFFER
Power Consumption of the MPC9443
and Thermal Management
operating frequency range up to 350 MHz. The MPC9443 power
consumption and the associated long-term reliability may
decrease the maximum frequency limit, depending on operating
conditions such as clock frequency, supply voltage, output
loading, ambient temperature, vertical convection and thermal
conductivity of package and board. This section describes the
impact of these parameters on the junction temperature and gives
a guideline to estimate the MPC9443 die junction temperature and
the associated device reliability. For a complete analysis of power
consumption as a function of operating conditions and associated
long term device reliability, please refer to the Freescale
application note AN1545. According the AN1545, the long-term
device reliability is a function of the die junction temperature.
Table 13. Die Junction Temperature and MTFBF
temperature and impact the device reliability (MTBF). According
to the system-defined tolerable MTBF, the die junction
temperature of the MPC9443 needs to be controlled, and the
thermal impedance of the board/package should be optimized.
The power dissipated in the MPC9443 is represented in Equation
1.
C
represents the external capacitive output load, and N is the
number of active outputs (N is always 16 in case of the MPC9443).
The MPC9443 supports driving transmission lines to maintain high
signal integrity and tight timing parameters. Any transmission line
will hide the lumped capacitive load at the end of the board trace;
therefore,
can be eliminated from Equation 1. Using parallel termination
output termination results in Equation 2 for power dissipation.
P
P
T
f
CLOCK,MAX
PD
MPC9443
2.5V, 3.3V LVCMOS CLOCK FANOUT BUFFER
J
TOT
TOT
The MPC9443 AC specification is guaranteed for the entire
Increased power consumption will increase the die junction
Where I
Junction Temperature (°C)
= T
is the power dissipation capacitance per output.
=
= V
A
[
+ P
Σ
I
CC
CCQ
CCQ
C
TOT
=
L
·
is zero for controlled transmission line systems and
[
100
110
120
130
is the static current consumption of the MPC9443,
C
+ V
I
· R
CCQ
PD
CC
thja
· N · V
+ V
1
· f
CLOCK
CC
2
CC
· f
CLOCK
·
·
(
[
N · C
T
·
j,MAX
(
PD
R
N · C
MTBF (Years)
thja
+
– T
Σ
M
20.4
PD
9.1
4.2
2.0
A
C
L
+
)
– (I
M
Σ
]
· V
C
CCQ
(Μ)Σ
L
CC
)
]
· V
C
+
L
CC
P
Σ
[
)
DC
]
Q
9
· I
or thevenin termination. V
the output termination technique, and DC
cycle. If transmission lines are used,
can be eliminated. In general, the use of controlled transmission
line techniques eliminates the impact of the lumped capacitive
loads at the end lines and greatly reduces the power dissipation of
the device. Equation 3 describes the die junction temperature (T
as a function of the power consumption.
to ambient), and T
Table
long-term device reliability. Further, combining Equation 1 and
Equation 2 results in a maximum operating frequency for the
MPC9443 in a series terminated transmission line system.
requirements and
Table
2S2P boards will result in a lower thermal impedance than
indicated below.
Table 14. Thermal Package Impedance of the 48 ld LQFP
becomes the upper clock speed limit for the given application
conditions. The following eight derating charts describe the safe
frequency operation range for the MPC9443. The charts were
calculated for a maximum tolerable die junction temperature of
110°C (120°C), corresponding to an estimated MTBF of 9.1 years
(4 years), a supply voltage of 3.3 V and series terminated
transmission line or capacitive loading. Depending on a given set
of these operating conditions and the available device convection
a decision on the maximum operating frequency can be made.
OH
In Equation 2, P stands for the number of outputs with a parallel
Where R
T
If the calculated maximum frequency is below 250 MHz, it
· (V
J,MAX
Convection,
13, the junction temperature can be used to estimate the
14. The R
100 lfpm
200 lfpm
300 lfpm
400 lfpm
500 lfpm
CC
Still air
LFPM
should be selected according to the MTBF system
– V
thja
OH
is the thermal impedance of the package (junction
thja
) + (1 – DC
A
Table
represent data based on 1S2P boards. Using
is the ambient temperature. According to
R
thja
13. R
OL
(1P2S board),
MPC9443 REV. 5 SEPTEMBER 19, 2008
Q
, I
K/W
) · I
69
64
thja
OL
OL
, V
can be derived from
· V
OH
Σ
C
OL
and I
L
Q
is zero in Equation 2 and
]
R
is the clock signal duty
thja
OH
Equation 1
Equation 2
Equation 3
Equation 4
(2P2S board),
are a function of
K/W
53
50
J)