MC100ES6221TBR2 IDT, Integrated Device Technology Inc, MC100ES6221TBR2 Datasheet - Page 3

• Manufacturer Part Number: MC100ES6221TBR2
• Manufacturer: IDT, Integrated Device Technology Inc
• Type: Clock Driverr

Specifications of MC100ES6221TBR2

• Number Of Clock Inputs: 2
• Mode Of Operation: Differential
• Output Frequency: 2000MHz
• Output Logic Level: ECL/PECL
• Operating Supply Voltage (min): -2.375/2.375V
• Operating Supply Voltage (typ): -2.5/-3.3/2.5/3.3V
• Operating Supply Voltage (max): -3.465/3.465V
• Package Type: TQFP EP
• Operating Temp Range: 0C to 110C
• Operating Temperature Classification: Commercial
• Signal Type: ECL/HSTL/PECL
• Mounting: Surface Mount
• Pin Count: 52
• Quiescent Current: 160mA
• Lead Free Status / RoHS Status: Not Compliant

IDT™ Low Voltage 1:20 Differential ECL/PECL/HSTL Clock Fanout Buffer
Freescale Timing Solutions Organization has been acquired by Integrated Device Technology, Inc
MC100ES6221
Low Voltage 1:20 Differential ECL/PECL/HSTL Clock Fanout Buffer
Advanced Clock Drivers Devices
Freescale Semiconductor
Table 3. Absolute Maximum Ratings
Table 4. General Specifications
1. Absolute maximum continuous ratings are those maximum values beyond which damage to the device may occur. Exposure to these
1. Output termination voltage V
2. Operating junction temperature impacts device life time. Maximum continuous operating junction temperature should be selected according
θ
JA
Symbol
conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation at absolute-maximum-rated
conditions is not implied.
to the application life time requirements (See application note AN1545 for more information). The device AC and DC parameters are
specified up to 110°C junction temperature allowing the MC100ES6221 to be used in applications requiring industrial temperature range. It
is recommended that users of the MC100ES6221 employ thermal modeling analysis to assist in applying the junction temperature
specifications to their particular application.
Symbol
T
V
, θ
I
HBM
CDM
V
FUNC
V
OUT
V
MM
I
T
C
OUT
LU
T
CC
IN
IN
JB
S
TT
IN
J
, θ
JC
Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Current
DC Output Current
Storage Temperature
Functional Temperature Range
Output Termination Voltage
ESD Protection (Machine Model)
ESD Protection (Human Body Model)
ESD Protection (Charged Device Model)
Latch-Up Immunity
Input Capacitance
Thermal Resistance (junction-to-ambient,
junction-to-board, junction-to-case)
Operating Junction Temperature
(continuous operation)
TT
Characteristics
= 0 V for V
Characteristics
(1)
CC
= 2.5 V operation is supported but the power consumption of the device will increase.
(2)
MTBF = 9.1 years
3
T
A
–0.3
–0.3
–0.3
Min
–65
See
= –40
4000
2000
Min
200
200
0
Table 9. Thermal Resistance
V
CC
Typ
4.0
– 2
(1)
T
V
V
J
CC
CC
Max
= +110
±20
±50
125
3.6
+ 0.3
+ 0.3
Max
110
°C/W
Unit
Unit
mA
pF
°C
mA
mA
°C
°C
V
V
V
V
V
V
V
MC100ES6221
Inputs
Condition
Condition
MC100ES6221
NETCOM
3