680-125A Wakefield Thermal Solutions, 680-125A Datasheet - Page 12

HEATSINK POWER TO-3 BLK

680-125A

Manufacturer Part Number
680-125A
Description
HEATSINK POWER TO-3 BLK
Manufacturer
Wakefield Thermal Solutions
Series
680r
Datasheets

Specifications of 680-125A

Thermal Resistance
1.5 C / W
Height
1.250" (31.7mm)
Color
Black
Package Cooled
TO-3
Attachment Method
Bolt On
Outline
45.97mm x 45.97mm
Power Dissipation @ Temperature Rise
8W @ 45°C
Thermal Resistance @ Forced Air Flow
1.5°C/W @ 400 LFM
Thermal Resistance @ Natural
6°C/W
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
46 mm L x 46 mm W x 31.8 mm H
Designed For
TO-3, TO-220
Packages Cooled
TO-3 / TO-220
Width
46mm
Heat Sink Material
Aluminum
Length
46mm
Mounting Type
PC Board Through Hole
Size
1.250H X 1.810W X 1.810L"
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
345-1051

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
680-125A
Manufacturer:
WAK
Quantity:
320
WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
6/14/07
10:55 AM
This top-hat style booster heat sink can be added to any of the 270, 272, or 280
Series for improved performance.
Standard
P/N
288-1ABE
Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good
electrical connections for vertical mounting of TO-220 and TO-202 semiconduc-
tor packages. These heat sinks are designed for use where minimum PC board
Standard
P/N
271-AB
Material: Aluminum, Black Anodized
288 SERIES
271 SERIES
Page 33
Semiconductor Case
Height Above
0.500 (12.7)
Compact Wave-Solderable Low-Cost Heat Sinks
Top-Mount Booster Heat Sinks for Use with 270/272/280 Series
in. (mm)
Height Above
1.250 (31.8)
PC Board
in. (mm)
1.750 (44.5) x 0.700 (17.8)
288 SERIES
Mounting Footprint
271 SERIES
Dimensions
Horizontal
in. (mm)
0.875 (22.2) x 0.215 (5.5)
Maximum
Footprint
in. (mm)
31 °C @ 4W (NOTE B)
62°C @ 4W (NOTE A)
space is available. The 288-1AB is a stamped aluminum heat sink, black an-
odized, designed for applications requiring good heat dissipation from a heat
sink occupying minimum space, available at minimum cost.
NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance
(total) as shown with (2) 271-AB types added to (1) 272-AB type.
Convection
Thermal Performance at Typical Load
Natural
Thermal Performance at Typical Load
85°C @ 4W
Convection
Natural
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
NATURAL AND FORCED
1.8°C/W 400 LFM (NOTE B)
5.1°C/W @ 400 LFM
12°C/W @ 200 LFM
Convection
Forced
Convection
Forced
Board Level
Heat Sinks
TO-220, TO-202
0.0057 (2.59)
0.0052 (2.36)
lbs. (grams)
lbs. (grams)
Weight
TO-220
Weight
33

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