680-125A Wakefield Thermal Solutions, 680-125A Datasheet - Page 20

• Manufacturer Part Number: 680-125A
• Description: HEATSINK POWER TO-3 BLK
• Manufacturer: Wakefield Thermal Solutions
• Series: 680r

Specifications of 680-125A

• Thermal Resistance: 1.5 C / W
• Height: 1.250" (31.7mm)
• Color: Black
• Package Cooled: TO-3
• Attachment Method: Bolt On
• Outline: 45.97mm x 45.97mm
• Power Dissipation @ Temperature Rise: 8W @ 45°C
• Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM
• Thermal Resistance @ Natural: 6°C/W
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 46 mm L x 46 mm W x 31.8 mm H
• Designed For: TO-3, TO-220
• Packages Cooled: TO-3 / TO-220
• Width: 46mm
• Heat Sink Material: Aluminum
• Length: 46mm
• Mounting Type: PC Board Through Hole
• Size: 1.250H X 1.810W X 1.810L"
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 345-1051

WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed
circuit boards. Maximum semiconductor package width: 0.625 (15.9). Refer to the Accessory
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
6/14/07
10:56 AM
Standard
P/N
647-1OABEP
647-15ABEP
647-175ABEP
647-20ABEP
647-25ABEP
Material: Aluminum, Black Anodized
Standard
P/N
657-10ABEP
657-15ABEP
657-20ABEP
657-25ABEP
Wave-solderable pins. Material: Aluminum, Black Anodized
657 SERIES
647 SERIES
Page 41
Height Above
PC Board “A”
1.000 (25.4)
1.500 (38.1)
2.000 (50.8)
2.500 (63.5)
in. (mm)
PC Board “A”
High-Performance Heat Sinks for Vertical Board Mounting
High-Performance Heat Sinks for Vertical Board Mounting
1.000 (25.4)
1.500 (38.1)
1.750 (44.5)
2.000 (50.8)
2.500 (63.5)
Height Above
in. (mm)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
1.650 (41.9) x 1.000 (25.4)
Maximum Footprint
Maximum
Footprint
in. (mm)
(EXTRUSION PROFILE 5195)
in. (mm)
657 SERIES
(EXTRUSION PROFILE 6533)
657 SERIES
647 SERIES
Products section for thermal interface materials, 126 Series silicone-free thermal compounds,
and other accessories products.
Convection
41°C @ 6W
38°C @ 6W
32°C @ 6W
25°C @ 6W
Thermal Performance at Typical Load
Natural
42°C @ 6W
37°C @ 6W
34°C @ 6W
31°C @ 6W
25°C @ 6W
Thermal Performance at Typical Load
Convection
Natural
CONVECTION CHARACTERISTICS
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
3.8°C/W @ 200 LFM
3.5°C/W @ 200 LFM
3.3°C/W @ 200 LFM
3.1°C/W @ 200 LFM
2.8°C/W @ 200 LFM
3.7°C/W @ 200 LFM
3.3°C/W @ 200 LFM
2.9°C/W @ 200 LFM
2.7°C/W @ 200 LFM
NATURAL AND FORCED
Convection
Convection
Forced
Forced
TO-220, TO-247, TO-218
Board Level
Heat Sinks
0.055 (24.95)
0.075 (34.02)
0.090 (40.82)
0.104 (47.17)
0.125 (56.70)
lbs. (grams)
0.0515 (23.36)
0.0760 (34.60)
0.1030 (47.00)
0.1250 (57.00)
lbs (grams)
Weight
TO-220
Weight
41