680-125A Wakefield Thermal Solutions, 680-125A Datasheet - Page 22

• Manufacturer Part Number: 680-125A
• Description: HEATSINK POWER TO-3 BLK
• Manufacturer: Wakefield Thermal Solutions
• Series: 680r

Specifications of 680-125A

• Thermal Resistance: 1.5 C / W
• Height: 1.250" (31.7mm)
• Color: Black
• Package Cooled: TO-3
• Attachment Method: Bolt On
• Outline: 45.97mm x 45.97mm
• Power Dissipation @ Temperature Rise: 8W @ 45°C
• Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM
• Thermal Resistance @ Natural: 6°C/W
• Product: Heatsinks
• Mounting Style: SMD/SMT
• Heatsink Material: Aluminum
• Fin Style: Omnidirectional Pin
• Dimensions: 46 mm L x 46 mm W x 31.8 mm H
• Designed For: TO-3, TO-220
• Packages Cooled: TO-3 / TO-220
• Width: 46mm
• Heat Sink Material: Aluminum
• Length: 46mm
• Mounting Type: PC Board Through Hole
• Size: 1.250H X 1.810W X 1.810L"
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 345-1051

WTS001_p26-49
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are
available in three standard types to mount and cool one TO-3 or TO-66 metal power semicon-
ductor type or two plastic package TO-220 power semiconductor types. For higher power
Achieve optimum natural convection cooling per unit volume occupied above the printed
circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases,
when this low-cost heat sink is used. Any mounting attitude will provide free circulation of air in
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
Dimensions: in. (mm)
MECHANICAL
DIMENSIONS
6/14/07
10:56 AM
Standard
P/N
690-3B
690-66B
690-220B
Material: Aluminum, Black Anodized
Standard
P/N
680-5A
680-75A
680-10A
680-125A
680-5220
680-75220
680-10220
680-125220
Material: Aluminum, Black Anodized
690 SERIES
680 SERIES
690 SERIES
Page 43
Maximum Efficiency Omnidirectional Heat Sinks
PC Board “A”
HIghest Efficiency/Lowest Unit Cost Heat Sinks
1.310 (33.3)
1.310 (33.3)
1.310 (33.3)
0.500 (12.7)
0.750 (19.1)
1.000 (25.4)
1.250 (31.8)
0.500 (12.7)
0.750 (19.1)
1.000 (25.4)
1.250 (31.8)
Height Above
Height Above
PC Board
in. (mm)
in. (mm)
TO-3
A
TO-3
Footprint Dimensions
Horizontal Mounting
Outline Dimensions
1.860 (47.2)-sq
1.860 (47.2)-sq
1.860 (47.2)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
1.810 (46.0)-sq
in. (mm)
in. (mm)
SEMICONDUCTOR MOUNTING HOLES
SEMICONDUCTOR MOUNTING HOLES
680 SERIES
*TWO TO-220’S
220
semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting
surface temperature rise above ambient air temperature of no more than 91°C.
natural convection applications. These 680 Series heat sinks can also be specified without any
semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K).
TO-66
Thermal Performance at Typical Load
Thermal Performance at Typical Load
7O°C @ 7.5W
44°C @ 7.5W
44°C @ 7.5W
44°C @ 7.5W
70°C @ 7.5W
58°C @ 7.5W
52°C @ 7.5W
45°C @ 7.5W
58°C @ 7.5W
52°C @ 7.5W
45°C @ 7.5W
Convection
Convection
Natural
Natural
2.0°C/W @ 400 LFM
2.0°C/W @ 400 LFM
2.0°C/W @ 400 LFM
3.0°C/W @ 400 LFM
2.4°C/W @ 400 LFM
2.0°C/W @ 400 LFM
1.5°C/W @ 400 LFM
3.0°C/W @ 400 LFM
2.4°C/W @ 400 LFM
2.0°C/W @ 400 LFM
1.5°C/W @ 400 LFM
*TWO TO-220’S
Convection
Convection
Forced
Forced
CONVECTION CHARACTERISTICS
K
NATURAL AND FORCED
Semiconductor
Semiconductor
CONVECTION CHARACTERISTICS
Hole Pattern
Hole Pattern
(2) TO-220
(2) TO-220
(2) TO-220
(2) TO-220
(2) TO-220
Mounting
(1) TO-66
Mounting
(1) TO-3
(1) TO-3
(1) TO-3
(1) TO-3
(1) TO-3
NATURAL AND FORCED
Board Level
TO-3, TO-66, TO-220
Heat Sinks
TO-3, TO-220
0.0700 (31.75)
0.0700 (31.75)
0.0700 (31.75)
0.0700 (31.75)
0.0900 (40.82)
0.0980 (44.45)
0.1100 (49.90)
0.0700 (31.75)
0.0900 (40.82)
0.0980 (44.45)
0.1100 (49.90)
lbs. (grams)
lbs. (grams)
Weight
Weight
43