624-45AB Wakefield Thermal Solutions, 624-45AB Datasheet - Page 18
624-45AB
Manufacturer Part Number
624-45AB
Description
HEATSINK CPU 21MM SQ W/OUT ADH
Manufacturer
Wakefield Thermal Solutions
Series
624r
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 624-45AB
Height
0.45" (11.43mm)
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
21.00mm x 21.00mm
Packages Cooled
BGA / LED
Width
21mm
Heat Sink Material
Aluminum
Length
21mm
Mounting Type
Clip-On
Package / Case
BGA
Color
Black
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
21 mm L x 21 mm W x 11.4 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
Q1897442
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
ROCKER CLIP OPTION
(SEE PRODUCT DES.)
SPRING CLIP OPTION
(SEE PRODUCT DES.)
2.34
OPTIONAL THERMAL INTERFACE
PAD (SEE PRODUCT DES.)
1.00
2.68
.23
1.50
.42
1.50
100 = 1.00"
MODEL NUMBER
HEIGHT
569 - 100 XX - XX
THERMAL INTERFACE
S4 = DELTALINK IV
BLANK = NO THERMAL PAD
CLIP
AK = SPRING CLIP
14-16 Pin DIPs