624-45AB Wakefield Thermal Solutions, 624-45AB Datasheet - Page 2
![HEATSINK CPU 21MM SQ W/OUT ADH](/photos/23/69/236944/4413608_sml.jpg)
624-45AB
Manufacturer Part Number
624-45AB
Description
HEATSINK CPU 21MM SQ W/OUT ADH
Manufacturer
Wakefield Thermal Solutions
Series
624r
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 624-45AB
Height
0.45" (11.43mm)
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
21.00mm x 21.00mm
Packages Cooled
BGA / LED
Width
21mm
Heat Sink Material
Aluminum
Length
21mm
Mounting Type
Clip-On
Package / Case
BGA
Color
Black
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
21 mm L x 21 mm W x 11.4 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
Q1897442
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
30
25
20
15
10
5
0
20
18
16
14
12
10
8
6
4
2
0
200
200
300
Approach Velocity, LFM
300
Approach Velocity, LFM
PRODUCT FEATURES
PRODUCT FEATURES
400
400
624-25-T4
624-35-T4
624-45-T4
624-60-T4
625-25-T4
625-25-T4
625-45-T4
625-60-T4
500
500
600
600