PCF2123TS/1.118 NXP Semiconductors, PCF2123TS/1.118 Datasheet - Page 52

• Manufacturer Part Number: PCF2123TS/1.118
• Manufacturer: NXP Semiconductors

Specifications of PCF2123TS/1.118

• Bus Type: Serial (3-Wire, SPI)
• Package Type: TSSOP
• Operating Supply Voltage (max): 5.5V
• Operating Temperature Classification: Industrial
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Mounting: Surface Mount
• Date Format: DW:DM:M:Y
• Time Format: HH:MM:SS
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
16. Handling information
17. Packing information
PCF2123
Product data sheet
Fig 36. PCF2123Ux wafer information
1.449 mm
(1) Die marking code.
Seal ring plus gap to active circuit ~18 μm.
1
1
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling Metal-Oxide Semiconductor (MOS) devices ensure that
all normal precautions are taken as described in JESD625-A, IEC 61340-5 or equivalent
standards.
Table 49.
Type number
PCF2123U/10AA/1
PCF2123U/12AA/1
PCF2123U/12HA/1
1.492 mm
X
straight edge
of the wafer
PCF2123Ux wafer information
(1)
All information provided in this document is subject to legal disclaimers.
1
1
Rev. 03 — 5 October 2010
Wafer thickness
200
200
150
45 μm
6 inch
6 inch
Wafer diameter
6 inch
SPI Real time clock/calendar
Saw lane
detail X
~18 μm
Marking of bad die
inking
wafer mapping
wafer mapping
70 μm
PCF2123
© NXP B.V. 2010. All rights reserved.
013aaa232
~18 μm
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