PCF2123TS/1.118 NXP Semiconductors, PCF2123TS/1.118 Datasheet - Page 56
![](/photos/31/30/313006/sot402-1_sml.jpg)
PCF2123TS/1.118
Manufacturer Part Number
PCF2123TS/1.118
Description
Manufacturer
NXP Semiconductors
Datasheet
1.PCF2123TS1.118.pdf
(61 pages)
Specifications of PCF2123TS/1.118
Bus Type
Serial (3-Wire, SPI)
Package Type
TSSOP
Operating Supply Voltage (max)
5.5V
Operating Temperature Classification
Industrial
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Mounting
Surface Mount
Date Format
DW:DM:M:Y
Time Format
HH:MM:SS
Lead Free Status / RoHS Status
Compliant
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NXP Semiconductors
19. Abbreviations
PCF2123
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Table 52.
Acronym
CMOS
BCD
ESD
FFC
HBM
LSB
MM
MOS
MSB
MSL
PCB
RTC
SMD
SPI
Fig 39. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Abbreviations
All information provided in this document is subject to legal disclaimers.
Description
Complementary Metal Oxide Semiconductor
Binary Coded Decimal
ElectroStatic Discharge
Film Frame Carrier
Human Body Model
Least Significant Bit
Machine Model
Metal Oxide Semiconductor
Most Significant Bit
Moisture Sensitivity Level
Printed-Circuit Board
Real Time Clock
Surface Mount Device
Serial Peripheral Interface
Rev. 03 — 5 October 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
SPI Real time clock/calendar
temperature
peak
PCF2123
© NXP B.V. 2010. All rights reserved.
001aac844
time
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