AU5790D14 NXP Semiconductors, AU5790D14 Datasheet - Page 14

• Manufacturer Part Number: AU5790D14
• Description: Network Controller & Processor ICs SINGLE WIRE CAN TRANSCEIVER
• Manufacturer: NXP Semiconductors

Specifications of AU5790D14

• Number Of Transceivers: 1
• Power Down Mode: Sleep/Standby
• Operating Supply Voltage (max): 27V
• Operating Supply Voltage (typ): 13V
• Operating Supply Voltage (min): 5.3V
• Package Type: SO
• Supply Current: 90mA
• Operating Temperature (max): 125C
• Operating Temperature (min): -40C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 14
• Product: Controller Area Network (CAN)
• Data Rate: 83.3 Kbps
• Supply Voltage (max): 27 V
• Supply Voltage (min): 5.3 V
• Supply Current (max): 90 mA
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Package / Case: SO
• Lead Free Status / RoHS Status: Compliant
• Other names: AU5790D14,512

Philips Semiconductors
THERMAL CHARACTERISTICS
The AU5790 provides protection from thermal overload. When the
IC junction temperature reaches the threshold ( 155 C), the
AU5790 will disable the transmitter drivers, reducing power
dissipation to protect the device. The transmit function will become
available again after the junction temperature drops. The thermal
shutdown hysteresis is about 5 C.
In order to avoid this transmit function shutdown, care must be taken
to not overheat the IC during application. The relationships between
junction temperature, ambient temperature, dissipated power, and
thermal resistance can be expressed as:
2001 May 18
Single wire CAN transceiver
200
150
100
150
100
50
50
0
0
0
0
100
50
Figure 6.
Figure 5.
Cu area on fused pins (mm2)
Cu area on fused pins (mm2)
100
200
SO-14 Thermal Resistance vs. PCB Configuration, Note 1, 2, 3
SO-8 Thermal Resistance vs. PCB Configuration, Note 1, 2, 3
150
300
200
400
14
T
where: T
T
P
Thermal Resistance
Thermal resistance is the ability of a packaged IC to dissipate heat
to its environment. In semiconductor applications, it is highly
dependant on the IC package, PCBs, and airflow. Thermal
resistance also varies slightly with input power, the difference
between ambient and junction temperatures, and soldering material.
Figures 5 and 6 show the thermal resistance as the function of the
IC package and the PCB configuration, assuming no airflow.
a
ja
j
d
=T
is ambient temperature ( C);
is dissipated power (W);
is thermal resistance ( C/W).
a
+ P
250
500
j
is junction temperature ( C);
d
*
ja
very low
conductance
board
low
conductance
board
high
conductance
board
very low
conductance
board
low
conductance
board
high
conductance
board
SL01249
SL01250
AU5790
Product data