LAN9313-NU Standard Microsystems (SMSC), LAN9313-NU Datasheet - Page 9

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LAN9313-NU

Manufacturer Part Number
LAN9313-NU
Description
Manufacturer
Standard Microsystems (SMSC)
Datasheet

Specifications of LAN9313-NU

Lead Free Status / RoHS Status
Supplier Unconfirmed
Three Port 10/100 Managed Ethernet Switch with MII
SMSC LAN9313/LAN9313i
D2/E2
D1/E1
D/E
ddd
ccc
A1
A2
A
L
b
c
e
Notes:
1. All dimensions are in millimeters unless otherwise noted.
2. Dimensions b & c apply to the flat section of the lead foot between 0.10 and 0.25mm from the lead tip. The
3. Dimensions D1 and E1 do not include mold protrusions. Maximum allowed protrusion is 0.25mm per side. D1
4. Dimensions D2 and E2 represent the size of the exposed pad. The exposed pad shall be coplanar with the
5. The pin 1 identifier may vary, but is always located within the zone indicated.
15.80
13.80
0.05
0.95
6.35
0.45
0.13
0.09
0.00
MIN
Figure 7 LAN9313/LAN9313i 128-XVTQFP Recommended PCB Land Pattern
base metal is exposed at the lead tip.
and E1 are maximum plastic body size dimensions including mold mismatch.
bottom of the package within 0.05mm.
-
-
NOMINAL
Table 2 LAN9313/LAN9313i 128-XVTQFP Dimensions
0.40 BSC
16.00
14.00
0.60
1.00
6.50
0.18
-
-
-
-
-
PRODUCT PREVIEW
16.20
14.20
MAX
1.20
0.15
1.05
6.65
0.75
0.23
0.20
0.07
0.08
9
Overall Package Height
X/Y Exposed Pad Size
X/Y Plastic Body Size
Lead Foot Thickness
True Position Spread
Lead Foot Length
Body Thickness
REMARKS
Lead Width
Coplanarity
Lead Pitch
X/Y Span
Standoff
Revision 1.7 (06-29-10)

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