LAN91C111I-NC Standard Microsystems (SMSC), LAN91C111I-NC Datasheet - Page 5

• Manufacturer Part Number: LAN91C111I-NC
• Manufacturer: Standard Microsystems (SMSC)

Specifications of LAN91C111I-NC

• Lead Free Status / RoHS Status: Supplier Unconfirmed

10/100 Non-PCI Ethernet Single Chip MAC + PHY
Package Outlines
SMSC LAN91C111 REV C
D/2
E/2
ccc
ccc
A1
A2
E1
R1
R2
L1
W
D1
A
D
E
H
L
e
q
Notes:
1. Controlling Unit: millimeter
2. Tolerance on the position of the leads is ± 0.035 mm maximum
3. Package body dimensions D1 and E1 do not include the mold protrusion.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-1.08 mm.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
6. Shoulder widths must conform to JEDEC MS-026 dimension 'S' of a minimum of 0.20mm.
15.80
13.80
15.80
13.80
0.05
0.95
7.90
7.90
0.09
0.45
0.13
0.08
0.08
MIN
0
~
~
~
~
Maximum mold protrusion is 0.25 mm
o
Figure 2 128 Pin TQFP Package Outline, 14X14X1.0 Body
0.40 Basic
NOMINAL
16.00
14.00
16.00
14.00
1.00
8.00
8.00
0.60
1.00
0.18
~
~
~
~
~
~
~
~
Table 1 128 Pin TQFP Package Parameters
PRODUCT PREVIEW
0.0762
16.20
14.20
16.20
14.20
MAX
1.20
0.15
1.05
8.10
8.10
0.20
0.75
0.23
0.20
0.08
7
~
~
o
5
1
1
/
/
Lead Foot Length from Centerline
2
2
X Span Measure from Centerline
Y Span Measure from Centerline
Coplanarity (Assemblers)
Coplanarity (Test House)
Overall Package Height
Lead Frame Thickness
Lead Shoulder Radius
Lead Foot Radius
Lead Foot Angle
Body Thickness
Lead Length
X body Size
Y body Size
Lead Width
Lead Pitch
REMARK
Standoff
X Span
Y Span
Revision 1.91 (08-18-08)