HI-8482J*100 Holt Integrated Circuits, HI-8482J*100 Datasheet - Page 8
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HI-8482J*100
Manufacturer Part Number
HI-8482J*100
Description
Manufacturer
Holt Integrated Circuits
Datasheet
1.HI-8482J100.pdf
(10 pages)
Specifications of HI-8482J*100
Lead Free Status / RoHS Status
Not Compliant
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
BSC = “Basic Spacing between Centers”
is theoretical true position dimension and
has no tolerance. (JEDEC Standard 95)
20-PIN PLASTIC SMALL OUTLINE (SOIC) - WB
(Wide Body)
20-PIN CERAMIC SIDE-BRAZED DIP
(10.325 ± .318)
.4065 ± .0125
(3.175)
.125
(1.27)
.050
min
BSC
(5.080)
.200
(12.789 ± .191)
.5035 ± .0075
max
HOLT INTEGRATED CIRCUITS
(.432 ±.051)
.017 ±.002
(25.400 ±.254)
1.000 ±.010
(1.270)
.050
typ
(.457)
.018
HI-8482 PACKAGE DIMENSIONS
8
(7.493 ± .051)
.295 ± .002
0° to 8°
typ
(2.159 ± .229)
.085 ±.009
(7.874 ±.254)
(2.54)
(.838 ± .432)
.100
.310 ± . 0 10
.033 ± .017
BSC
(7.620 ± .254)
.300 ± .010
(2.286 ± .254)
.090 ± .010
(.2667 ± .0381)
See Detail A
.0105 ± .0015
Detail A
inches (millimeters)
inches (millimeters)
Package Type: 20HW
Package Type: 20C
.0075 ± .0035
(.254 ±.051/- .025)
.010 + . 0 02/-.001
(.191 ± .089)