PIC12LF1840-E/P Microchip Technology, PIC12LF1840-E/P Datasheet - Page 50

• Manufacturer Part Number: PIC12LF1840-E/P
• Description: 7 KB Flash, 256 Bytes RAM, 32 MHz Int. Osc, 6 I/0, Enhanced Mid Range Core, Nano
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 12Fr

Specifications of PIC12LF1840-E/P

• Processor Series: PIC12F
• Core: PIC
• Program Memory Type: Flash
• Program Memory Size: 7 KB
• Data Ram Size: 256 B
• Interface Type: MI2C, SPI, EUSART
• Number Of Timers: 3
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• Package / Case: PDIP-8
• Development Tools By Supplier: MPLAB IDE Software
• Minimum Operating Temperature: - 40 C
• Core Processor: RISC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 5
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Lead Free Status / Rohs Status: Details

PIC12(L)F1840
FIGURE 5-3:
DS41441B-page 50
Note 1: A series resistor (R
Note 1: Quartz
C1
C2
2: The value of R
2: Always verify oscillator performance over
3: For oscillator design assistance, reference
quartz crystals with low drive level.
selected (typically between 2 M to 10 M.
• AN826, “Crystal Oscillator Basics and
• AN849, “Basic PIC
• AN943, “Practical PIC
• AN949, “Making Your Oscillator Work”
according
manufacturer. The user should consult the
manufacturer data sheets for specifications
and recommended application.
the V
expected for the application.
the following Microchip Applications Notes:
Crystal Selection for rfPIC
Devices” (DS00826)
(DS00849)
Analysis and Design” (DS00943)
(DS00949)
Quartz
Crystal
R
S
DD
(1)
and temperature range that is
crystal
QUARTZ CRYSTAL
OPERATION (LP, XT OR
HS MODE)
F
to
varies with the Oscillator mode
OSC1/CLKIN
OSC2/CLKOUT
R
S
type,
F
PIC
) may be required for
(2)
®
characteristics
Oscillator Design”
®
®
MCU
Oscillator
®
package
and PIC
Sleep
To Internal
Logic
®
vary
and
Preliminary
FIGURE 5-4:
5.2.1.3
If the oscillator module is configured for LP, XT or HS
modes, the Oscillator Start-up Timer (OST) counts
1024 oscillations from OSC1. This occurs following a
Power-on Reset (POR) and when the Power-up Timer
(PWRT) has expired (if configured), or a wake-up from
Sleep. During this time, the program counter does not
increment and program execution is suspended. The
OST ensures that the oscillator circuit, using a quartz
crystal resonator or ceramic resonator, has started and
is providing a stable system clock to the oscillator
module.
In order to minimize latency between external oscillator
start-up and code execution, the Two-Speed Clock
Start-up mode can be selected (see
“Two-Speed Clock Start-up
5.2.1.4
The oscillator module contains a 4X PLL that can be
used with both external and internal clock sources to
provide a system clock source. The input frequency for
the 4X PLL must fall within specifications. See the PLL
Clock
“Electrical
The 4X PLL may be enabled for use by one of two
methods:
1.
2.
Note 1: A series resistor (R
Program the PLLEN bit in Configuration Word 2
to a ‘1’.
Write the SPLLEN bit in the OSCCON register to
a ‘1’. If the PLLEN bit in Configuration Word 2 is
programmed to a ‘1’, then the value of SPLLEN
is ignored.
C1
C2 Ceramic
2: The value of R
3: An additional parallel feedback resistor (R
Timing
Resonator
ceramic resonators with low drive level.
selected (typically between 2 M to 10 M.
may be required for proper ceramic resonator
operation.
Specifications”.
Oscillator Start-up Timer (OST)
4X PLL
R
Specifications
P
R
(3)
S (1)
CERAMIC RESONATOR
OPERATION
(XT OR HS MODE)
 2011 Microchip Technology Inc.
F
varies with the Oscillator mode
OSC1/CLKIN
OSC2/CLKOUT
Mode”).
S
R
) may be required for
F
PIC
(2)
®
in
MCU
Section 30.0
Section 5.4
To Internal
Logic
Sleep
P
)