PIC12LF1840-E/SN Microchip Technology, PIC12LF1840-E/SN Datasheet - Page 321

• Manufacturer Part Number: PIC12LF1840-E/SN
• Description: 7 KB Flash, 256 Bytes RAM, 32 MHz Int. Osc, 6 I/0, Enhanced Mid Range Core, Nano
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 12Fr

Specifications of PIC12LF1840-E/SN

• Processor Series: PIC12F
• Core: PIC
• Program Memory Type: Flash
• Program Memory Size: 7 KB
• Data Ram Size: 256 B
• Interface Type: MI2C, SPI, EUSART
• Number Of Timers: 3
• Operating Supply Voltage: 1.8 V to 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Package / Case: SOIC-8
• Development Tools By Supplier: MPLAB IDE Software
• Minimum Operating Temperature: - 40 C
• Core Processor: RISC
• Core Size: 8-Bit
• Speed: 32MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 5
• Eeprom Size: 256 x 8
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Lead Free Status / Rohs Status: Details

30.0
Absolute Maximum Ratings
Ambient temperature under bias....................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on V
Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current out of V
Maximum current into V
Maximum current into V
Clamp current, I
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Note 1:
 2011 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL SPECIFICATIONS
Power dissipation is calculated as follows: P
DD
DD
with respect to V
with respect to V
K
(V
PIN
(1)
DD
DD
< 0 or V
............................................................................................................................... 800 mW
SS
SS
pin, -40°C  T
pin, -40°C  T
pin, -40°C  T
pin, -40°C  T
PIN
SS
SS
, PIC12F1840 ............................................................................. -0.3V to +6.5V
, PIC12LF1840 ........................................................................... -0.3V to +4.0V
> V
(†)
DD
A
A
SS
)20 mA
A
A
 +85°C for industrial.................................................................. 800 mA
 +125°C for extended ................................................................. 30 mA
 +85°C for industrial................................................................. 85 mA
 +125°C for extended .............................................................. 35 mA
........................................................................... -0.3V to (V
Preliminary
DIS
= V
DD
x {I
DD
–  I
OH
} +  {(V
PIC12(L)F1840
DD
– V
OH
) x I
DS41441B-page 321
OH
} + (V
DD
+ 0.3V)
O
l x I
OL
).