PIC16F1934-I/MV Microchip Technology, PIC16F1934-I/MV Datasheet - Page 280
![7KB Flash, 256B RAM, 256B EEPROM, LCD, 1.8-5.5V 40 UQFN 5x5x0.5mm TUBE](/photos/16/12/161286/qfn44_sml.jpg)
PIC16F1934-I/MV
Manufacturer Part Number
PIC16F1934-I/MV
Description
7KB Flash, 256B RAM, 256B EEPROM, LCD, 1.8-5.5V 40 UQFN 5x5x0.5mm TUBE
Manufacturer
Microchip Technology
Series
PIC® XLP™ 16Fr
Datasheets
1.PIC16F722-ISS.pdf
(8 pages)
2.PIC16LF1933-ISS.pdf
(508 pages)
3.PIC16LF1933-ISS.pdf
(46 pages)
4.PIC16F1936-ISS.pdf
(2 pages)
5.PIC16F1936-ISS.pdf
(10 pages)
6.PIC16F1936-ISS.pdf
(40 pages)
7.PIC16F1936-ISS.pdf
(30 pages)
8.PIC16F1936-ISS.pdf
(12 pages)
Specifications of PIC16F1934-I/MV
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LCD, POR, PWM, WDT
Number Of I /o
36
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 14x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
44-VQFN Exposed Pad
Processor Series
PIC16F
Core
PIC
Data Ram Size
256 B
Interface Type
MI2C, SPI, EUSART
Number Of Timers
5
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MPLAB IDE Software
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC16F1934-I/MV
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- PIC16F722-ISS PDF datasheet
- PIC16LF1933-ISS PDF datasheet #2
- PIC16LF1933-ISS PDF datasheet #3
- PIC16F1936-ISS PDF datasheet #4
- PIC16F1936-ISS PDF datasheet #5
- PIC16F1936-ISS PDF datasheet #6
- PIC16F1936-ISS PDF datasheet #7
- PIC16F1936-ISS PDF datasheet #8
- Current page: 280 of 508
- Download datasheet (5Mb)
PIC16F193X/LF193X
23.6.13.2
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
When the user releases SDA and the pin is allowed to
float high, the BRG is loaded with SSPADD and counts
down to zero. The SCL pin is then deasserted and
when sampled high, the SDA pin is sampled.
FIGURE 23-36:
FIGURE 23-37:
DS41364D-page 280
A low level is sampled on SDA when SCL goes
from low level to high level.
SCL goes low before SDA is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
SDA
SCL
BCLIF
RSEN
S
SSPIF
SDA
SCL
RSEN
BCLIF
S
SSPIF
Bus Collision During a Repeated
Start Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SCL goes low before SDA,
set BCLIF. Release SDA and SCL.
Preliminary
T
BRG
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
If SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’, Figure 23-35).
If SDA is sampled high, the BRG is reloaded and begins
counting. If SDA goes from high-to-low before the BRG
times out, no bus collision occurs because no two
masters can assert SDA at exactly the same time.
If SCL goes from high-to-low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition,
see Figure 23-36.
If, at the end of the BRG time-out, both SCL and SDA
are still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is
complete.
T
Cleared by software
2009 Microchip Technology Inc.
BRG
Interrupt cleared
by software
’0’
’0’
’0’
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