PIC24HJ128GP506A-I/MR Microchip Technology, PIC24HJ128GP506A-I/MR Datasheet - Page 22
![16 Bit MCU 40MIPS 128KB FLASH 64 QFN 9x9x0.9mm TUBE](/photos/12/13/121325/c04-149_mr_sml.jpg)
PIC24HJ128GP506A-I/MR
Manufacturer Part Number
PIC24HJ128GP506A-I/MR
Description
16 Bit MCU 40MIPS 128KB FLASH 64 QFN 9x9x0.9mm TUBE
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ64GP206A-IMR.pdf
(304 pages)
3.PIC24HJ64GP206A-IMR.pdf
(10 pages)
Specifications of PIC24HJ128GP506A-I/MR
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
128KB (43K x 24)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 18x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-VFQFN, Exposed Pad
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8192 B
Interface Type
SPI, I2C, UART
Maximum Clock Frequency
7.37 MHz
Number Of Timers
13
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 140 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
16 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARD
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ64GP206A-IMR PDF datasheet #2
- PIC24HJ64GP206A-IMR PDF datasheet #3
- Current page: 22 of 304
- Download datasheet (3Mb)
PIC24HJXXXGPX06A/X08A/X10A
FIGURE 2-1:
2.2.1
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including MCUs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that con-
nects the power supply source to the device, and the
maximum current drawn by the device in the applica-
tion. In other words, select the tank capacitor so that it
meets the acceptable voltage sag at the device. Typical
values range from 4.7 µF to 47 µF.
2.3
A low-ESR (< 5 Ohms) capacitor is required on the
V
voltage regulator output voltage. The V
pin must not be connected to V
capacitor between 4.7 µF and 10 µF, 16V connected to
ground. The type can be ceramic or tantalum. Refer to
Section 24.0
additional information.
The placement of this capacitor should be close to the
V
length not exceed one-quarter inch (6 mm). Refer to
Section 21.2 “On-Chip Voltage Regulator” for
details.
DS70592B-page 22
CAP
CAP
Ceramic
V
0.1 µF
DD
R
/V
/V
C
DDCORE
DDCORE
R1
Capacitor on Internal Voltage
Regulator (V
TANK CAPACITORS
10
MCLR
V
V
SS
DD
. It is recommended that the trace
“Electrical
pin, which is used to stabilize the
RECOMMENDED
MINIMUM CONNECTION
PIC24H
CAP
Ceramic
0.1 µF
/V
Characteristics”
DD
DDCORE
, and must have a
V
V
CAP
DD
SS
Ceramic
0.1 µF
Ceramic
0.1 µF
)
/V
Ceramic
0.1 µF
DDCORE
Preliminary
for
2.4
The MCLR pin provides for two specific device
functions:
• Device Reset
• Device programming and debugging
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR pin. Consequently,
specific voltage levels (V
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application and PCB requirements.
For
recommended that the capacitor C, be isolated from
the MCLR pin during programming and debugging
operations.
Place the components shown in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2:
Note 1: R 10 k is recommended. A suggested
example,
2: R1 470 will limit any current flowing into
Master Clear (MCLR) Pin
V
starting value is 10 k. Ensure that the MCLR
pin V
MCLR from the external capacitor C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
V
IH
DD
R
JP
and V
C
IH
as
and V
IL
shown
EXAMPLE OF MCLR PIN
CONNECTIONS
specifications are met.
R1
2009 Microchip Technology Inc.
IL
IH
specifications are met.
and V
MCLR
in
PIC24H
IL
Figure 2-2,
) and fast signal
it
is
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