PIC24HJ128GP506A-I/MR Microchip Technology, PIC24HJ128GP506A-I/MR Datasheet - Page 23
![16 Bit MCU 40MIPS 128KB FLASH 64 QFN 9x9x0.9mm TUBE](/photos/12/13/121325/c04-149_mr_sml.jpg)
PIC24HJ128GP506A-I/MR
Manufacturer Part Number
PIC24HJ128GP506A-I/MR
Description
16 Bit MCU 40MIPS 128KB FLASH 64 QFN 9x9x0.9mm TUBE
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ64GP206A-IMR.pdf
(304 pages)
3.PIC24HJ64GP206A-IMR.pdf
(10 pages)
Specifications of PIC24HJ128GP506A-I/MR
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
128KB (43K x 24)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 18x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-VFQFN, Exposed Pad
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
8192 B
Interface Type
SPI, I2C, UART
Maximum Clock Frequency
7.37 MHz
Number Of Timers
13
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 140 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
16 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARD
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ64GP206A-IMR PDF datasheet #2
- PIC24HJ64GP206A-IMR PDF datasheet #3
- Current page: 23 of 304
- Download datasheet (3Mb)
2.5
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP™) and debugging pur-
poses. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes, and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communi-
cations to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternatively, refer to the AC/DC characteristics and
timing requirements information in the respective
device Flash programming specification for information
on capacitive loading limits and pin input voltage high
(V
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
For more information on ICD 2, ICD 3 and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip website.
• “MPLAB
• “Using MPLAB
• “MPLAB
• “Using MPLAB
• “MPLAB
• “MPLAB
• “Using MPLAB
2009 Microchip Technology Inc.
IH
Guide” DS51331
(poster) DS51765
Guide” DS51616
) and input low (V
®
ICSP Pins
ICD 2, MPLAB ICD 3 or MPLAB REAL ICE™.
®
®
®
®
ICD 2 In-Circuit Debugger User’s
ICD 2 Design Advisory” DS51566
ICD 3 Design Advisory” DS51764
REAL ICE™ In-Circuit Emulator User’s
®
®
®
ICD 2” (poster) DS51265
ICD 3 In-Circuit Debugger”
REAL ICE™” (poster) DS51749
IL
) requirements.
PIC24HJXXXGPX06A/X08A/X10A
Preliminary
2.6
Many MCUs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to Section 9.0 “Oscillator
Configuration” for details).
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in Figure 2-3.
FIGURE 2-3:
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
External Oscillator Pins
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
DS70592B-page 23
13
14
15
16
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18
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20
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