S29AL008J55TFIR20 Spansion Inc., S29AL008J55TFIR20 Datasheet - Page 52
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S29AL008J55TFIR20
Manufacturer Part Number
S29AL008J55TFIR20
Description
IC 8M FLASH MEMORY
Manufacturer
Spansion Inc.
Datasheet
1.S29AL008J55TFIR20.pdf
(56 pages)
Specifications of S29AL008J55TFIR20
Cell Type
NOR
Density
8Mb
Access Time (max)
55ns
Interface Type
Parallel
Boot Type
Bottom
Address Bus
20/19Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
3 to 3.6V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
3V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
1M/512K
Supply Current
12mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
S29AL008J55TFIR20
Manufacturer:
SPANSION
Quantity:
20 000
20.2
52
VBK048—48-Ball Fine-Pitch Ball Grid Array (BGA) 8.15 mm x 6.15 mm
CORNER
PACKAGE
JEDEC
SYMBOL
A
SD / SE
PIN A1
MD
ME
D1
A1
A2
E1
φb
A
D
E
N
e
A1
MIN
0.18
0.62
0.35
8.15 mm x 6.15 mm NOM
---
INDEX MARK
10
PACKAGE
8.15 BSC.
6.15 BSC.
5.60 BSC.
4.00 BSC.
0.80 BSC.
0.40 BSC.
VBK 048
NOM
N/A
---
---
---
48
---
---
8
6
SEATING PLANE
TOP VIEW
SIDE VIEW
MAX
1.00
0.76
0.43
---
D
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S29AL008J
NOTE
D a t a
A
0.10
A2
C
(4X)
E
B
S h e e t
e
0.08
0.10
NOTES:
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
4.
5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
6
7
8. NOT USED.
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
C
C
6
AS NOTED).
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
φb
φ 0.08
φ 0.15
H
M
M
C
C
G
A
BOTTOM VIEW
S29AL008J_00_09 February 23, 2010
B
F
E
D1
D
SD
C
7
B
A
6
5
4
3
2
1
3338 \ 16-038.25b
SE
A1 CORNER
7
E1