STM32F100RET6B STMicroelectronics, STM32F100RET6B Datasheet - Page 80
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STM32F100RET6B
Manufacturer Part Number
STM32F100RET6B
Description
16/32-BITS MICROS
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F100RCT6TR.pdf
(97 pages)
Specifications of STM32F100RET6B
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
24MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
-
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F100RET6B
Manufacturer:
NXP
Quantity:
11 430
Company:
Part Number:
STM32F100RET6B
Manufacturer:
STMicroelectronics
Quantity:
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Company:
Part Number:
STM32F100RET6BTR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Electrical characteristics
Figure 32. SPI timing diagram - master mode
1. Measurement points are done at CMOS levels: 0.3V
5.3.18
Note:
80/97
NSS input
CPHA= 0
CPOL=0
CPHA= 0
CPOL=1
CPHA=1
CPOL=0
CPHA=1
CPOL=1
OUTUT
INP UT
MISO
MOSI
HDMI consumer electronics control (CEC)
Refer to
input/output alternate function characteristics.
12-bit ADC characteristics
Unless otherwise specified, the parameters given in
from tests performed under the ambient temperature, f
voltage conditions summarized in
It is recommended to perform a calibration after each power-up.
High
t su(MI)
Section 5.3.13: I/O current injection characteristics
M SB OUT
t w(SCKH)
t w(SCKL)
MS BIN
t v(MO)
t h(MI)
t c(SCK)
Doc ID 15081 Rev 5
DD
Table
and 0.7V
B I T1 OUT
9.
BI T6 IN
DD
t h(MO)
STM32F100xC, STM32F100xD, STM32F100xE
.
Table 51
PCLK2
for more details on the
frequency and V
are preliminary values derived
LSB OUT
t r(SCK)
t f(SCK)
LSB IN
DDA
supply
ai14136